摘要
采用正交试验法确定了CuIn_(5)合金放电等离子烧结(SPS)的最佳工艺参数,研究了烧结温度、烧结时间、烧结压力对CuIn_(5)合金的致密度、硬度和导电性能的影响。结果表明:影响CuIn_(5)合金致密度和硬度的主要因素均为烧结温度,其次为烧结压力,烧结时间的影响最小;影响CuIn_(5)合金电导率的主要因素为烧结温度,其次为烧结时间和烧结压力。利用SPS技术制备CuIn_(5)合金的最佳工艺为烧结温度850℃,烧结时间5 min,烧结压力50 MPa。采用最佳工艺制备的CuIn_(5)合金组织均匀致密,In_(5)固溶于Cu中形成固溶体,其晶格常数为0.362 865 nm,晶格畸变率为0.38%,致密度为99.56%,显微硬度为136.3 HV0.1,导电率为37.86%IACS。
Optimum parameters of spark plasma sintering(SPS) process of CuIn_(5)alloy were determined by orthogonal experiment. The effect of sintering temperature, sintering time and sintering pressure on density, hardness and electrical conductivity of the CuIn_(5)alloy was studied. The results show that the main factor affecting density and hardness of the CuIn_(5)alloy is sintering temperature, followed by sintering pressure, and sintering time has the least effect;the main factors affecting the conductivity of the CuIn_(5)alloy is sintering temperature, followed by sintering time and sintering pressure. The optimum process for preparing CuIn_(5)alloy by SPS process consists of sintering temperature of 850 ℃, sintering time of 5 min and sintering pressure of 50 MPa. The microstructure of CuIn_(5)alloy prepared by the best process is uniform and compact, In is dissolved in Cu to form a solid solution, the lattice constant is 0.362 865 nm, the lattice distortion is 0.38%, the density is 99.56%, the microhardness is 136.3 HV0.1, and the conductivity is 37.86%IACS.
作者
樊帅奇
李海涛
王雪松
张蕾涛
徐金富
戴姣燕
Fan Shuaiqi;Li Haitao;Wang Xuesong;Zhang Leitao;Xu Jinfu;Dai Jiaoyan(School of Materials Science and Engineering,Chang’an University,Xi’an Shaanxi 710061,China;School of Materials Science and Chemical Engineering,Ningbo University of Technology,Ningbo Zhejiang 315211,China)
出处
《金属热处理》
CAS
CSCD
北大核心
2022年第7期76-80,共5页
Heat Treatment of Metals
基金
宁波市2025重大专项(2019B10084)。
关键词
放电等离子烧结
Cu-In合金
烧结工艺
组织性能
spark plasma sintering
Cu-In alloy
sintering process
microstructure and properties
作者简介
樊帅奇(1996—),男,硕士研究生,主要研究方向为高强高导铜合金,E-mail:1445848185@qq.com;通信作者:戴姣燕,博士,E-mail:djy211@163.com。
