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激光切割SiCp/Al复合材料去除机制研究 被引量:1

Research on removal mechanism of SiCp/Al composites by laser cutting
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摘要 采用连续激光以10 mm/s的速度对厚度分别为0.8 mm、1.0 mm、1.2 mm和1.5 mm的工件进行切割实验,通过对切缝全貌、切入口、中段和切出口的形貌观察和分析发现,激光切割SiCp/Al复合材料的过程分为打孔和切缝形成两个阶段,在切缝周围存在热影响区(HAZ)。在激光的照射、热传递和辅助气体吹除的共同作用下,Al基体主要以汽化、熔化的方式被去除,汽化集中发生在切入口处,熔化集中发生在中段和切出口处。SiC颗粒主要以升华和从母材脱落的方式被去除,切入口处SiC颗粒的升华较中段和切出口处更为明显。切缝底部和切出口周围的挂渣主要为冷却凝结的Al基体。工件厚度较大时,切入口破损更小,切缝中段和切出口表面更平整,切出口处挂渣量更大。 The cutting experiments were carried out on workpieces with thicknesses of 0.8 mm,1.0 mm,1.2 mm and 1.5 mm at a cutting speed of 10 mm/s using a continuous laser.By observing and analyzing the morphology of the whole slit,the front,the middle and the rear sections,it was found that the process of laser cutting SiCp/Al composites was divided into two stages:punching and slit formation,and there was a heat-affected zone(HAZ)around the slit.Under the combined action of laser irradiation,heat transfer and auxiliary gas blowing,the Al matrix is mainly removed by vaporization and melting,with vaporization occurring at the front section and melting occurring in the middle section and rear section.The SiC particles are mainly removed by sublimation and falling off from the base metal,and the sublimation of SiC particles at the front section is more obvious than that in the middle section and the rear section.Melting Al matrix cools and coagulates to slags at the bottom and around the slit.When the thickness of the workpiece is larger,the breakage of the entrance is smaller,the surfaces of the middle and rear sections of the slit are smoother,and the amount of slags hanging at the rear section is larger.
作者 王景磊 庞博 WANG Jinglei;PANG Bo(Division of Engineering Training,Inner Mongolia University of Technology,Hohhot 010051,China)
出处 《内蒙古工业大学学报(自然科学版)》 2022年第3期209-215,共7页 Journal of Inner Mongolia University of Technology:Natural Science Edition
基金 内蒙古工业大学科学研究项目(ZY201924)。
关键词 SICP/AL复合材料 激光切割 去除机制 SiCp/Al composites laser cutting remove mechanism
作者简介 王景磊(1985-),男,讲师,研究方向:新材料精密和特种加工技术。
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