摘要
对半导体封装工艺的研究,先探析半导体工艺概述,能对其工作原理有一定的了解与掌握;再考虑半导体封装工艺流程,目的是在作业阶段严谨管控,能采用精细化管理模式,在细节上规避常规问题发生;再从新时代发展背景下提出半导体封装工艺面临的挑战,建议把工作重心放在半导体封装工艺质量控制方面,要对其要点内容全面掌握,才可有效提升半导体封装工艺质量。
The study of semiconductor packaging process,firstly,explore the overview of semiconductor process,can have a certain understanding and mastery of its working principle;then consider the semiconductor packaging process,the purpose is to strictly control in the operation stage,can adopt fine management mode,in the details to avoid the occurrence of conventional problems;then from the background of the development of the new era to put forward the challenges facing the semiconductor packaging process,it is recommended to focus on the semiconductor packaging It is recommended to focus on the quality control of the semiconductor packaging process and to have a comprehensive grasp of its key points in order to effectively improve the quality of the semiconductor packaging process.
作者
张鎏
苑明星
杨小渝
Zhang Liu;Yuan Mingxing;Yang Xiaoyu(Chongqing Acoustic Optoelectronics Co.,Ltd.,Chongqing 400000)
出处
《现代工业经济和信息化》
2022年第6期81-84,共4页
Modern Industrial Economy and Informationization
关键词
半导体
封装工艺
质量控制
semiconductor
packaging process
quality control
作者简介
第一作者:张鎏(1991-),男,重庆人,本科,工程师,研究方向为半导体封装。
