摘要
以一种可耐高温的氰酸酯导电胶为研究对象,设定5种固化工艺曲线,验证导电胶在不同温度下固化后的可靠性。结果表明:固化温度为330℃时,芯片与基板之间的孔隙率为0%且两者之间的粘结力最大,达到29.42 kg;当固化温度较低时,芯片与基板之间的空隙率较大;当固化温度过高时,基板与芯片之间的剪切强度仅为10.04 kg。因此,根据导电胶具体的理化性能选择合适的固化曲线对提高封装过程中的装片可靠性具有十分重要的意义。
Taking a cyanate ester conductive adhesive that can withstand high temperature as the research object,5 curing process curves are set to verify the performance of conductive adhesive after curing at different temperatures.The results show that:at 330 ℃,the porosity between the chip and the substrate is 0%,and the adhesion between them is the largest,reaching 29.42 kg;when the curing temperature is low,it easily leads to larger porosity;when the curing temperature is too high,the shear strength between the chip and the substrate is only 10.04 kg.Therefore,selecting a suitable curing curve according to the specific physical and chemical properties of the conductive adhesive is of great significance to improve the reliability of the mounting process in the packaging process.
作者
朱召贤
周悦
王涛
杨兵
ZHU Zhaoxian;ZHOU Yue;WANG Tao;YANG Bing(The 58 th Research Institute of CETC,Wuxi 214035,China)
出处
《电子产品可靠性与环境试验》
2022年第3期42-47,共6页
Electronic Product Reliability and Environmental Testing
关键词
固化温度
氰酸酯
耐高温导电胶
可靠性
curing temperature
cyanate ester
high temperature resistant conductive adhesive
reliability
作者简介
朱召贤(1991-),男,安徽宿州人,中国电子科技集团公司第五十八研究所工程师,博士,主要从事微电子封装技术研究及其可靠性评价工作。
