摘要
伴随着各类载荷的小型化发展趋势,各类光/电子器件向着更高集成度方向发展,对热控系统带来更严苛的散热需求。芯片热流密度将达到1500 W·cm^(-2),目前各类散热技术均很难突破。本文针对千瓦每平方厘米级的“高热流密度、大功率”散热需求,提出了降级散热的新方法。采用超高热导率材料进行散热模块设计,将千瓦每平方厘米级降级至现有较为成熟的散热技术能耗散的百瓦每平方厘米量级。讨论了降级散热的传热特性和冷却工质的选择。针对降级散热的热点移除问题,提出雪花状和叶形仿生拓扑优化结构。为电子芯片的极高热流密度散热提供了新的解决思路。
With the development trend of miniaturization of various loads,optoelectronic devices are developing in the direction of higher integration,which brings more stringent heat dissipation requirements to the thermal control system.The heat flux density of the chip will reach 1500W·cm^(-2),and it is difficult to break through all kinds of heat dissipation technologies at present.This article puts forward a new Solution of degraded heat dissipation in response to the“high heat flow density and high power”heat dissipation requirements of 1000 W·cm^(-2).The use of ultra-high thermal conductivity materials for the heat dissipation module design will downgrade 1000 W·cm^(-2) level to the order of 100 W·c^(-2) that can be solved by the existing more mature heat dissipation technology.The heat transfer characteristics of degraded heat dissipation and the choice of cooling fluid are discussed.Aiming at the hotspot removal problem of degraded heat dissipation,a snowflakeshaped and leaf-shaped bionic topology optimization structure is proposed.That provides a new idea for the extremely high heat flux density of electronic chips to dissipate heat.
作者
李宇婷
徐超
陆规
LI Yuting;XU Chao;LU Gui(Key Laboratory of Power Station Energy Transfer Conversion and System of Ministry of Education,North China Electric Power University,Beijing 102206,China)
出处
《工程热物理学报》
EI
CAS
CSCD
北大核心
2022年第6期1580-1587,共8页
Journal of Engineering Thermophysics
基金
国家自然科学基金项目(No.52076074)。
关键词
极高热流密度散热
微通道
降级散热
仿生拓扑
extremely high heat flux
microchannel
degraded heat dissipation
bionic topology
作者简介
李宇婷(1995-),女,硕士研究生,主要从事流动及相变换热研究;通信作者:陆规,副教授,lugui02@gmail.com。
