摘要
针对石墨烯MEMS高温压力传感器的高气密要求,设计了一种压膜结构压力传感器,并利用Au-Au键合完成压力传感器的封装。键合前,样品表面采用Ar等离子体预处理,随后在N_(2)氛围下,利用倒装焊机在1.6 kN压力、300℃温度下键合30 min完成键合工艺。对键合指标进行表征测试,发现器件的最小剪切强度为10.87 MPa,最大泄漏率为9.88×10^(-4) Pa·cm^(3)/s,均满足GJB 548B-2005的要求。在300℃下高温存储(HTS)10 h后,器件的平均剪切强度和泄漏率变化不大,通过传感器压力静态测试发现石墨烯器件在0~60 MPa压力量程内具备高重复性,证明石墨烯在键合过程和高温存储实验后没有变性。实验结果表明Au-Au键合可以完成石墨烯MEMS高温压力传感器高气密封装。
To address its high hermeticity requirements,a high-temperature graphene MEMS pressure sensor was designed using pressure sensitive membrane structure and packaged by Au-Au bonding.The sample surface was treated by Ar plasma before bonding.The Au-Au bonding was performed at 300℃ for 30 min at a pressure of 1.6 kN.The bonding index test show that the minimum shear strength is 10.87 MPa and the maximum leakage rate is 9.88×10^(-4) Pa·cm^(3)/s,which all meet the requirements of GJB 548B-2005.After stored(HTS)at high temperature of 300℃ for 10 h,the average shear strength and leakage rate did not show notable change.Graphene devices have high repeatability from 0 to 60 MPa through pressure static test,which indicate the graphene does not deteriorate during the bonding process and high temperature storage.The results show that Au-Au bonding can complete the hermetic packaging of high temperature graphene MEMS pressure sensor.
作者
陈绪文
王俊强
吴天金
CHEN Xuwen;WANG Junqiang;WU Tianjin(School of Instrument and Electronics,North University of China,Taiyuan 030051,China;Academy for Advanced Interdisciplinary Research,North University of China,Taiyuan 030051,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2022年第5期508-513,共6页
Electronic Components And Materials
基金
国防科技173计划技术领域基金项目(2021JCJQJJ0172)。
作者简介
通信作者:王俊强,副教授,博士,主要从事石墨烯传感器、高温封装及三维集成研究。E-mail:wangjq210@nuc.edu.cn。
