摘要
近年来,微电子制造业得到了快速发展,对集成电路(Integrated Circuit)的需求也逐日提升,IC封装表面质量的优劣将决定芯片品质,因此制造企业对IC封装表面质量检测要求也越加重视。但碍于国内相关技术发展起步晚,大多数企业对于IC封装表面的检测还停留在人工和半自动检测阶段,这些方式存在检测效率低下、检测结果不稳定等问题,难以满足自动化生产需求。机器视觉技术能够有效解决上述问题,但是这项技术还未广泛应用于IC封装检测行业,因此,基于HALCON软件平台的IC封装自动目检系统研究具有重要应用研究价值。HALCON是德国MVtec公司开发的一套完善的标准的机器视觉算法包。它拥有应用广泛的机器视觉集成开发环境,它节约了产品成本,缩短了软件开发周期———HALCON灵活的架构便于机器视觉和图像分析应用的快速开发。在欧洲以及日本的工业界已经是公认具有最佳效能的机器视觉软件。MVtec公司是一家全球领先的机器视觉软件制造商,其产品可用于所有要求苛刻的成像领域,如半导体行业、表面检测、自动化光学检测系统等领域。
In recent years,the microelectronics manufacturing industry has developed rapidly,and the demand for integrated circuits(Integrated Circuit)is also increasing day by day.The quality of the surface quality of IC packages will determine the quality of the chips.Therefore,manufacturing companies have increased their requirements for surface quality testing of IC packages.Pay attention.However,due to the late start of domestic related technology development,most companies still remain at the manual and semi-automatic inspection stage for IC packaging surface inspection.These methods have problems such as low inspection efficiency and unstable inspection results,which are difficult to meet the needs of automated production.Machine vision technology can effectively solve the above prob-lems,but this technology has not been widely used in the IC packaging inspection industry.Therefore,the research on the HALCON-based platform IC packaging automatic visual inspection system has important application research value.HALCON is a complete set of standard machine vision algorithm packages developed by MVtec in Germany.It has a widely used machine vision integrated development environment,which saves product costs and shortens the software development cycle-HALCON’s flexible architecture facilitates the rapid development of machine vision and image analysis applications.In European and Japanese industries,it has been recognized as the best performance machine vision software.MVtec is a leading global company of machine vision software for all demanding fields,such as the semiconductor industry,surface inspection,automation optical systems,and more.
作者
姚建军
YAO Jian-jun(Wuxi China Resources Huajing Microelectronics Co.,Ltd.)
出处
《中国集成电路》
2022年第4期78-89,共12页
China lntegrated Circuit
关键词
IC封装
外观检测
图像划分
模板匹配
IC package
appearance detection
image division
template matching
作者简介
姚建军,获得江南大学硕士学位。无锡华润华晶微电子有限公司先进封装技术部封装开发工程师。现在主要从事先进功率器件封装开发以及相关封装可靠性仿真开发。
