摘要
高频高速挠性或刚挠结合印制电路板为抑制电磁干扰和减少信号传输损耗,在板面贴合电磁屏蔽膜。目前按传统工艺加工,刚挠结合印制板压合后出现电磁屏蔽膜掉膜而致品质不良,无法满足品质需求。本文通过对电磁屏蔽膜使用多种方案进行研究,有效地改善电磁屏蔽膜在制作过程中出现掉膜问题,为后续带电磁屏蔽膜刚挠结合印制板提供加工技术基础。
In order to restrain electromagnetic interference and reduce signal transmission loss,high frequency high-speed flexible or rigid-flexible printed circuit board is bonded with electromagnetic shielding film on the board surface.At present,according to the traditional process,the electromagnetic shielding film falls off after the rigid flex printed board is pressed,and the film quality is poor,which cannot meet the quality requirements.In this paper,through the research on the use of a variety of schemes of electromagnetic shielding film,the problem of falling off in the production process of electromagnetic shielding film is effectively improved,which provides the processing technology foundation for the subsequent charged magnetic shielding film rigid flexible board.
作者
赵相华
石学兵
樊廷慧
李波
Zhao Xianghua;Shi Xuebin;Fan Tinghui;Li bo
出处
《印制电路信息》
2022年第2期61-64,共4页
Printed Circuit Information
关键词
电磁屏蔽膜
脱膜
刚挠结合印制电路板
Electromagnetic Shielding Film
Falling Film
Rigid-Flex PCB
作者简介
第一作者:赵相华,NPI主管,从事PCB技术,有8年工作经验。
