摘要
采用Fluent软件对用于绝缘栅双极型晶体管芯片(IGBT)的散热器进行流体热仿真分析及试验验证。为了在设计阶段能够准确评估散热器性能,采用计算流体力学原理,搭建数值模型。研究了散热器在额定冷却液流速下入口与出口的压力损失,通过对比发现与试验结果较为吻合,从而验证了数值模型的可靠性。在此基础上,加入模块模型,输入芯片损耗,得出了每个IGBT模块的节点温度、散热器表面最高温度,仿真结果显示均在设计范围之内,进而验证了散热器在热设计方面的可靠性。
This paper uses Fluent software to perform fluid thermal simulation analysis and experimental verification on the heat sink used for insulated gate bipolar transistor chips(IGBT). In order to accurately evaluate the performance of the heat sink in the design stage, the principle of computational fluid dynamics is used to build a numerical model. The pressure loss at the inlet and outlet of the heat sink at the rated coolant flow rate is studied, and the comparison is found to be in good agreement with the test results, which verifies the reliability of the numerical model. On this basis, the module model is added, the chip loss is input, and the node temperature of each IGBT module and the highest temperature of the heat sink surface are obtained. The simulation results show that they are all within the design range, which verifies the reliability of the heat sink in thermal design.
作者
马雅青
闫家益
余军
MA Yaqing;YAN Jiayi;YU Jun(Zhuzhou CRRC Times Electric Innovation Center,Birmingham B377YE,UK;Zhuzhou CRRC Times Semiconductor Co.,Ltd.,Zhuzhou 412001,China)
出处
《机械工程师》
2022年第2期102-104,108,共4页
Mechanical Engineer
关键词
散热器设计
IGBT
仿真
试验验证
heat sink design
IGBT
simulation
experimental verification
作者简介
马雅青(1975-),女,本科,高级工程师,从事逆变器总体结构设计和功率模块设计工作;通信作者:闫家益(1988-),男,博士,高级工程师,从事结构强度以及热仿真设计工作,jiayi.yan@teic.crrczic.cc;余军(1987-),男,本科,高级工程师,从事功率半导体器件开发和应用方面的技术工作。
