摘要
综述了近年来国内外在耐高温聚酰亚胺(PI)粘接材料领域内的研究与应用进展情况。从PI粘接材料的发展历史、结构特征、分类以及改性和功能化现状等方面进行了阐述,着重介绍了聚酰胺酸(PAA)型、可溶或可熔PI型以及无溶剂型PI粘接材料基础与应用研究领域内的研究进展情况。最后结合中国地质大学(北京)在高性能PI粘接材料领域内的基础与产业化研究方面的进展,对该类型材料的未来发展趋势进行了展望。
The research and application progress of high-temperature resistant polyimide(PI) bonding materials at home and abroad in recent years were reviewed. Several aspects,including the developing history,structural characteristics,classification,modification and functionalization status of PI bonding materials were mainly presented. Particularly,the research progress in the basis and application research field of polyamide acid(PAA)type,soluble or fusible PI type and solvent-free PI bonding material was emphatically introduced.Finally,the future development trend of this type of material was prospected,combining with the progress of basis and industrialization research in the field of high-performance PI bonding materials in China University of Geosciences(Beijing).
作者
祁浩然
杨明伟
张新岭
吴昊
职欣心
张燕
杨洋
刘金刚
Qi Haoran;Yang Mingwei;Zhang Xinling;Wu Hao;Zhi Xinxin;Zhang Yan;Yang Yang;Liu Jingang(School of Materials Science and Technology,China University of Geosciences(Beijing),Beijing 100083,China;Composites Center of Commercial Aircraft Corporation of China,Ltd.(COMAC),Shanghai 201324,China)
出处
《中国胶粘剂》
CAS
2021年第12期49-54,70,共7页
China Adhesives
基金
山东省重点研发计划项目(2019JZZY020235)
上海市自然科学基金项目(17ZR1411800)。
关键词
聚酰亚胺
粘接
粘接剂
胶膜
polyimide
bonding
adhesive
adhesive film
作者简介
祁浩然(1997-),黑龙江哈尔滨人,硕士在读,主要从事高性能聚酰亚胺粘接材料研究工作.E-mail:2103200030@cugb.edu.cn;通信作者:刘金刚。E-mail:liujg@cugb.edu.cn;通信作者:杨洋.E-mail:yangyangl@comac.cc。
