摘要
低熔点金属相变材料在高性能芯片热控领域有着重要的应用价值。文中以典型的低熔点金属相变材料铋铟锡共晶合金Bi_(31.6)In_(48.8)Sn_(19.6)(E-BiInSn,熔点为60.2℃)为例,基于完全熔化临界时刻的准稳态热阻模型,对均匀热流密度边界条件下低熔点金属相变热沉热控性能进行了分析和优化。针对热功率为50 W、持续时间为50 s的单次热脉冲情形,分析了翅片个数和翅片厚度等关键几何参数以及热沉结构材料和相变材料热导率等关键热物性参数对热沉性能的影响规律,得到了相应的优化参数推荐值和热控性能预测图表。相关研究成果可用于指导低熔点金属相变热控技术的开发和优化设计。
The low melting point metal phase change material(PCM)has important application value in the thermal control field of the high performance chip.Taking the typical low melting point metal phase change material Bi31.6In48.8Sn19.6(E-BiInSn,with melting point of 60.2℃)as an example,analysis and optimization of the thermal control performance of low melting point metal phase change material based heat sink at the boundary of uniform heat flux density are carried out in this paper based on the quasi-steady state thermal resistance model at the critical moment of full melting.Aiming at the single thermal pulse of 50 W(50 s),effects of the key parameters such as fin number,fin width and thermal conductivity of structural material and PCM on the heat sink performance are analyzed and optimal parameters and performance prediction diagrams are obtained.The results in this paper can guide the design and optimization of low melting point metal based PCM heat sink.
作者
杨小虎
黄崇海
陈凯
陈列
YANG Xiaohu;HUANG Chonghai;CHEN Kai;CHEN Lie(Science and Technology on Thermal Energy and Power Technology,Wuhan Second Ship Design and Research Institute,Wuhan 430205,China)
出处
《电子机械工程》
2021年第6期16-21,58,共7页
Electro-Mechanical Engineering
基金
国家自然科学基金资助项目(52006158)
湖北省自然科学基金资助项目(2020CFB462)。
关键词
低熔点金属
相变材料
芯片冷却
热阻模型
性能优化
low melting point metal
phase change material
chip cooling
thermal resistance model
performance optimization
作者简介
杨小虎,男,1991年生,博士,工程师,主要从事热设计工作。
