摘要
业界有些印制电路板厂采用改良型半加成工艺(mSAP)生产细线线路,良率比较高,但是这种工艺需要较高的洁净等级条件,因此需要投资高价值的设备和设施。很多客户希望印制电路板厂采用减成法(Subtractive)生产细线线路,以降低成本。通过研究曝光能量、显影点、基底铜箔、铜厚、蚀刻线的蚀刻速度对精细线路制作的影响,优化参数,制作出了25μm/25μm,30μm/30μm,35μm/35μm,40μm/40μm的精细线路。
Some PCB factories in the industry use modified semi-additive process to produce fine lines,which has a higher yield rate.However,this process requires higher level clean conditions,so it needs to invest in high-value equipment and facilities.Many customers expect PCB factories to use subtractive method to produce fine lines to reduce costs.By studying the influence of exposure energy,break point,substrate copper foil,copper thickness and etching speed on fine line fabrication,the parameters are optimized to produce fine line of 25μm/25μm,30μm/30μm,35μm/35μm and 40μm/40μm.
作者
李君红
LI Junhong(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)
出处
《电子工艺技术》
2021年第6期349-352,共4页
Electronics Process Technology
关键词
改良型半加成
减成法
曝光能量
显影点
铜厚
铜箔
蚀刻速度
modified semi-additive process
subtractive method
exposure energy
break point
copper thickness
copper foil
etching speed
作者简介
李君红(1982-),女,毕业于华中科技大学,高级工程师,主要负责印制电路板及封装基板新工艺的开发和研究工作。
