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上海光源极紫外光刻胶检测平台

Extreme Ultraviolet Photoresist Inspection Platform in Shanghai Synchrotron Radiation Facility
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摘要 极紫外光刻技术作为下一代光刻技术,被行业赋予了拯救摩尔定律的使命。极紫外光刻胶是极紫外光刻技术的核心子技术之一,其分辨率、粗糙度、灵敏度以及放气情况等指标的检测是开展极紫外光刻胶研发的必要条件和实现极紫外光刻胶配方优化的重要环节。基于同步辐射的极紫外干涉光刻技术是目前最适合开展的一种用于极紫外光刻胶性能检测的方法。上海光源根据相关的研发需求,已建立了一个基于该方法的极紫外光刻胶检测平台。通过不断改善装置的稳定性,发展自主的分束光栅掩膜制作技术,以及不断摸索和优化相应的干涉曝光工艺,目前检测平台的曝光分辨率测试水平已能达到20 nm以下,基本满足极紫外光刻7 nm工艺节点的相应要求。 As the next generation of lithography technology,extreme ultraviolet lithography has been given the mission of saving Moore′s law by the industry.Extreme ultraviolet photoresist is one of the core sub-technologies of extreme ultraviolet lithography.The inspection of its resolution,roughness,sensitivity and outgassing conditions is a necessary condition for the development of extreme ultraviolet photoresist and it is also an important part to optimize the resist performance.Extreme ultraviolet interference lithography based on synchrotron radiation is currently the most suitable method for testing the performance of extreme ultraviolet photoresist.According to related research and development needs,an extreme ultraviolet photoresist inspection platform based on this method has been established in Shanghai Synchrotron Radiation Facility(SSRF).By continuously improving the stability of the device,developing independent beam splitting grating mask manufacturing technology,and constantly exploring and optimizing the corresponding interference exposure process,the current inspection resolution has reached below 20 nm,which basically meets the corresponding requirements for the 7 nm process node of extreme ultraviolet lithography.
作者 赵俊 杨树敏 薛超凡 吴衍青 陈宜方 邰仁忠 ZHAO Jun;YANG Shu-Min;XUE Chao-Fan;WU Yan-Qing;CHEN Yi-Fang;TAI Ren-Zhong(School of Informnation Science and Technology,Fudan University,Shanghai 200433,China;Shanghai Synchrotron Radiation Facility,Shanghai Advanced Research Institute,Chinese Academy of Sciences,Shanghai 201204,China)
出处 《应用化学》 CAS CSCD 北大核心 2021年第9期1168-1174,共7页 Chinese Journal of Applied Chemistry
基金 国家重点研发计划(Nos.2017YFA0206001,2016YFA0401302,2017YFA0403400) 国家自然科学基金项目(No.11775291,11875314)资助。
关键词 极紫外 光刻胶检测 干涉光刻 Extreme ultraviolet Photoresist inspection Interference lithography
作者简介 吴衍青,E-mail:wuyanqing@zjlab.org.cn。
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  • 1Stefan Wurm. Transition to EUV lithography[C]//Proceedings of the 2012 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2012.
  • 2Kim Hyun-Woo, Na Hal-Sub, Cho Kyoung-Yong, et al. Patterning with EUVL: the road to 22 nm node[C]//Proc of SPIE, 2010, 7636: 76360Q-1-76360Q-11.
  • 3Takahiro Kozawa, Seiichi Tagawa. Radiation chemistry in chemically amplified resists [J]. Japanese Journal of Applied Physics, 2010, 49(3): 030001-1- 030001-19.
  • 4Kim Jeongsik, Lee Jae -Woo, Kim Deogbae, et al. Measurement of EUV resists performances RLS by DUV light source[C]//SPIE, 2010, 7636: 76362Y-1- 76362Y-7.
  • 5Ken Maruyama, Hiroki Nakagawa, Shalini Sharma,et al EUV resist development for 16 nm half pitch [C]//SPIE 2012, 8325: 83250A-1-83250A-6.
  • 6Chawon Koh, Jacque Georger, Liping Ren, et al. Characterization of promising resist platforms for sub-30 nm liP manufacturability and EUV CAR extendibility study[C]// SPIE, 2010, 7636:763604-1-763604-16.
  • 7Thackeray James W, Jain Vipul, Coley Suzanne, et al. Optimization of Polymer-bound PAG (PBP) for 2011m EUV Lithography [J]. Journal of Photopolymer Science and Technology, 2011, 24(2): 179-183.
  • 8Hiroaki Oizumi, Kazuyuki Matsumaro, Julius Santillan, et al. Development of EUV resists based on various new materials [C]//SPIE, 2010, 7639: 76390R-1-76390R-8.
  • 9Masamitsu Shirai, Koichi Maki, Haruyuki Okamura, et al. EUV negative resist based on Thiol-Yne system [C]//SPIE, 2011, 7972: 79721E-1-79721E-8.
  • 10Jun Iwashita, Taku Hirayama, Isamu Takagi, et al. Characteristics of main chain decomposable STAR polymer for EUV resist[C]//SPIE, 2011, 7972: 79720L-1-79720L-10.

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