摘要
碳纳米管和石墨烯作为新型高导热材料,在微处理器散热领域的应用极具潜力。分别从实验研究和经典分子动力学模拟的角度,综述了目前碳纳米管与石墨烯热输运性质方面的研究进展,并讨论了不同因素对其热输运的影响。最后,提出亟需一种明确、统一的理论揭示碳纳米管与石墨烯的声子热输运机制,并对ShengBTE软件计算方法在石墨烯等低维碳纳米材料热输运研究领域的应用进行了展望。
As novel highly thermally conductive materials,carbon nanotubes and graphene are of great potential in microprocessor heat dissipation applications.Current research progress on thermal transport properties of carbon nanotubes and graphene were reviewed from the perspective of experimental research and classical molecular dynamics simulation,respectively.And the influence of different factors on the thermal transport of carbon nanotubes and graphene were discussed.Finally,the problem that a clear and unified theory was badly needed to reveal the phonon thermal transport mechanism of carbon nanotubes and graphene was proposed,and the application of ShengBTE calculation method in the studies on the thermal transport of low-dimensional carbon nanomaterials such as graphene was prospected.
作者
邵钶
刘远超
钟建斌
Shao Ke;Liu Yuanchao;Zhong Jianbin(School of Mechanical Engineering,Beijing Institute of Petrochemical Technology,Beijing 102617)
出处
《化工新型材料》
CAS
CSCD
北大核心
2021年第7期194-199,共6页
New Chemical Materials
基金
国家自然科学基金(51106012)。
作者简介
邵钶(1997-),男,硕士,主要从事低维碳纳米材料热输运过程的分子动力学模拟研究,E-mail:skvayne@163.com;通讯作者:刘远超(1977-),男,博士,副教授,主要从事燃烧理论与低污染控制技术、微纳尺度传热学等方面研究,E-mail:liuyuanchao@bipt.edu.cn。
