摘要
实现基于统一三维模型的设计、工艺及制造的全流程贯通,是复杂电子装备结构工艺样机研发模式发展的重要方向。它对于提高研制质量、缩短研发周期、减少设计差错等具有重要的意义。文中分析了复杂电子装备结构工艺研发过程中存在的问题,结合复杂电子装备的研制特点,提出了基于统一模型的复杂电子装备结构工艺数字样机全流程贯通研发新模式,对面向复杂电子装备的一体化平台构建、模型定义、模型传递、协同仿真、三维工艺向生产现场发布使用等关键技术进行了深入研究,实现了电子装备三维结构设计、工艺及制造的全流程贯通及工程应用,对推进复杂电子装备研发模式的创新具有重要的参考价值。
To achieve the whole process through from design,process to manufacture based on the unified 3 D model is an important development direction of the structural and process digital mock-up of complex electronic equipment.It is of great significance to improve the development quality,shorten the product period and reduce the design errors.The subsistent problems in the design process of complex electronic equipment are analyzed and a new design mode based on the unified digital prototype model from design to manufacture is put forward in this paper on the basis of development characteristics of complex electronic equipment.Meanwhile,the technologies such as integrated design platform construction,model definition,model transmission,collaborative simulation are studied deeply.The whole process through from design,process to manufacture based on the unified 3 D model is achieved and applied to engineering practice.It has great reference value to promote the design mode innovation of complex electronic equipment.
作者
胡长明
梅启元
张柳
胡青报
HU Changming;MEI Qiyuan;ZHANG Liu;HU Qingbao(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China;Nanjing Glaway Software Co.,Ltd.,Nanjing 210013,China)
出处
《电子机械工程》
2021年第3期1-8,共8页
Electro-Mechanical Engineering
关键词
全流程贯通
结构工艺样机
模型定义
模型传递
模型发布
三维工艺
whole process through
structural and process digital mock-up
model definition
model transmission
model publishing
3D process
作者简介
胡长明,男,1969年生,研究员级高级工程师,江苏省政协委员。现任中国电子科技集团公司第十四研究所首席专家,国家智能制造标准化专家咨询组成员,装备发展部电磁兼容及防护专家组成员,中国电子学会会士、电子机械工程分会常务副主任委员,中国企业联合会智慧企业推进委员会委员。主要从事雷达结构和智能制造技术研究,担任多型国家重大项目结构总设计师,推动结构工艺数字样机、拓扑优化、高效散热、机电一体化技术在海陆空天各领域雷达研发中的应用。主编或参编国军标多项,荣获国家科技进步一等奖1项,省部级科技进步奖8项,被评为江苏省“333高层次人才培养工程”首批中青年科技领军人才和中国电子学会优秀科技工作者。
