摘要
封装屏蔽是抗辐射加固技术领域的重要分支,相比于芯片的设计加固和工艺加固,具有成本低、周期短、难度小等优势,可根据集成电路应用时所处的辐射环境,选择相应的屏蔽材料实现有针对性的封装加固。基于复合金属材料屏蔽原理,提出一种一体化的抗辐射封装结构及其制备方法。屏蔽涂层制备具有涂覆精准、结合稳定,厚度可调节、成分可掺杂等特点。通过对一体化屏蔽封装开展FMEA分析,归纳总结制备过程中的典型失效模式,并根据严重度、频度和探测度,计算出风险系数RPN值,最终提出应对措施。
Packaging shielding is an important branch in the field of radiation hardening technology.Compared with the reinforcement of chip design and process,it has the advantages of low cost,short cycle and low difficulty.According to the radiation environment in which integrated circuits are applied,the corresponding shielding materials can be selected to achieve targeted packaging reinforcement.Based on the shielding principle of composite metal materials,an integrated anti-radiation packaging structure and its preparation method are proposed.The preparing of that shield coating has the characteristic of accurate coating,stable bonding,adjustable thickness,doping of component and the like.Through FMEA analysis of integrated shielding package,the typical failure modes in the preparation process are summarized,and the risk coefficient RPN value is calculated according to the severity,frequency and detection degree,and finally the countermeasures are put forward.
作者
赵鹤然
王吉强
李靖旸
康敏
孔明
ZHAO Heran;WANG Jiqiang;LI Jingyang;KANG Min;KONG Ming(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110000,China;Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China)
出处
《微处理机》
2021年第2期10-13,共4页
Microprocessors
关键词
屏蔽
封装加固
抗辐射
总剂量效应
电子辐射
Shielding
Package reinforcement
Radiation hardening
Total dose effect
Electron radiation
作者简介
赵鹤然(1986-),男,辽宁省沈阳市人,硕士,高级工程师,主研方向:电子封装可靠性,封装加固。
