摘要
对多层陶瓷电容器的一种典型失效形式进行研究。将多层陶瓷电容器焊后进行极限高低温冲击试验,试验发现焊接端头会出现微裂纹。微裂纹底部与外电极金属边缘重合,裂纹斜向上延伸,与焊接面之间呈锐角。裂纹贯穿交叠电极时会导致陶瓷电容器的电性能失效。后续可以根据实际情况为多层陶瓷电容器设计适宜的上下护片厚度、外电极端头宽度及单侧电极宽度,以保证其承受温冲后电性能不受影响,也可通过优化多层陶瓷电容器的结构设计和材料选型,进一步提高多层陶瓷电容器的抗极限温冲的能力。
A kind of typical failure mode of the multilayer ceramic capacitor is studied.The extreme high and low temperature impact test of multilayer ceramic capacitor is carried out after soldering,it is found that micro cracks would appear at the soldering end.The bottom of the micro crack coincides with the metal electrode edge,the micro crack extends obliquely upward with an acute angle to the soldering surface.The micro cracks affect the electrical properties when the cracks run through the overlapping electrodes.The thickness of suitable protective sheet,the width of outer electrode end and the width of one side electrode can be designed for multilayer ceramic capacitors according to the actual situation to ensure that their electrical properties is not affected after high and low temperature impact.However,the structure design and material selection of multilayer ceramic capacitor can be also optimized to improve the ability to resist high and low temperature impact.
作者
吕晓云
黄栋
叶晓飞
席亚莉
李敏娟
LV Xiaoyun;HUANG Dong;YE Xiaofei;XI Yali;LI Minjuan(The 771st Research Institute of CASC,Xi’an 710100,China)
出处
《电子工艺技术》
2021年第2期93-95,共3页
Electronics Process Technology
关键词
多层陶瓷电容器
高低温冲击试验
微裂纹
电极
护片厚度
multilayer ceramic capacitor
high and low temperature impact test
micro crack
electrode
protective sheet thickness
作者简介
吕晓云(1990-),女,硕士,毕业于西北工业大学,工程师,主要从事混合电路微组装工艺方面的研究工作。
