摘要
绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)作为柔性直流输电交直流变换的关键部件,其可靠性直接决定柔性直流输电系统的稳定运行。在换流阀运行过程中IGBT模块会受到各种不同的故障影响,导致电流急剧上升,从而造成IGBT模块温度升高使焊料层产生一定的损伤,最终导致焊料层疲劳失效。为此,以柔性直流输电换流阀用IGBT模块为研究对象对其进行功率循环条件下电磁-热-机械应力耦合分析。再利用基于应变的疲劳寿命模型,根据Coffin-Manson公式,以焊料层单个功率循环产生的非弹性应变增量为条件,对焊料层进行寿命预测。最后设计了10 kW/1000 A功率循环试验平台,对仿真分析得出的电、热特性以及焊料层疲劳寿命进行验证。结果表明上焊料层温度分布与键合线键合点位置分布相关,下焊料层温度分布与芯片位置分布有关;焊料层温度分布不均、温差较大引起的热应力是导致焊料层疲劳失效的主要原因,且上焊料层疲劳寿命小于下焊料层。
Insulated gate bipolar transistor(IGBT)is the core component of AC/DC conversion in VSC-HVDC,and its reliability directly determines the stable operation of VSC-HVDC.During the operation of the converter valve,various faults cause the IGBT module current to rise sharply,and the rising current can arouse temperature rise of IGBT module and cause certain damage to the solder layer,and long-term damage eventually leads to fatigue failure of the solder layer.Therefore,the IGBT module for VSC-HVDC converter valve is taken as the research object to conduct the electromagnetic-thermal-mechanical stress coupling analysis under the power cycle condition.Subsequently,by using Coffin-Manson formula of strain-based fatigue life model,the life expectancy of the solder layer is predicted under the condition of the inelastic strain increment generated by a single power cycle of the solder layer.Finally,a 10 kW/1000 A power cycle test platform was designed to verify the electrical characteristics,thermal characteristics and fatigue life of the solder layer obtained by simulation analysis.The results show that the temperature distribution of the upper solder layer is related to the bonding points and the bonding wires distribution,and the temperature distribution of the lower solder layer is related to the chip position distribution.The thermal stress caused by uneven temperature distribution of the solder layer and large temperature difference are the main causes of the solder layer fatigue failure,and the fatigue life of the upper solder layer is less than that of the lower solder layer.
作者
张宇娇
范虹兴
张炫焜
阮江军
黄雄峰
ZHANG Yujiao;FAN Hongxing;ZHANG Xuankun;RUAN Jiangjun;HUANG Xiongfeng(School of Electrical Engineering and Automation,Hefei University of Technology,Hefei 230009,China;State Grid Jinhua Power Supply Company,Jinhua 321017,China;Skills Training Center,State Grid Chongqing Electric Power Company,Chongqing 400053,China;School of Electrical Engineering and Automation,Wuhan University,Wuhan 430072,China)
出处
《高电压技术》
EI
CAS
CSCD
北大核心
2020年第10期3381-3389,共9页
High Voltage Engineering
基金
国家自然科学基金(51577106)
湖北省杰出青年基金(2019CFA085)
省部共建电工装备可靠性与智能化国家重点实验室(河北工业大学)开放基金(EERIKF2018008)。
作者简介
通讯作者:黄雄峰,1980—,男,博士,副教授,主要从事物联网技术及其在电气工程领域的应用等方面的研究,E-mail:sxdxhuangxf@163.com;张宇娇,1978—,女,博士,教授,主要从事电磁多物理场数值计算及其工程应用;输电线路先进设计;施工及智能运维等方面的研究工作。湖北省新世纪高层次人才,湖北省杰出青年基金获得者,E-mail:jiao_zyj@163.com。
