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High crystalline quality of SiGe fin fabrication with Si-rich composition area using replacement fin processing

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摘要 A high crystalline quality of SiGe fin with an Si-rich composition area using the replacement fin processing is systematically demonstrated in this paper.The fin replacement process based on a standard FinFET process is developed.A width of less than 20-nm SiGe fin without obvious defect impact both in the direction across the fin and in the direction along the fin is verified by using the high angle annular dark field scanning transmission electron microscopy and the scanning moiréfringe imaging technique.Moreover,the SiGe composition is inhomogenous in the width of the fin.This is induced by the formation of 111 facets.Due to the atomic density of the 111 facets being higher,the epitaxial growth in the direction perpendicular to these facets is slower than in the direction perpendicular to 001.The Ge incorporation is then higher on the 111 facets than on the 001 facets.So,an Si-rich area is observed in the central area and on the bottom of SiGe fin.
作者 Ying Zan Yong-Liang Li Xiao-Hong Cheng Zhi-Qian Zhao Hao-Yan Liu Zhen-Hua Hu An-Yan Du Wen-Wu Wang 昝颖;李永亮;程晓红;赵治乾;刘昊炎;吴振华;都安彦;王文武(Integrated Circuit Advanced Process Center,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China)
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2020年第8期441-444,共4页 中国物理B(英文版)
基金 the Beijing Municipal Natural Science Foundation,China(Grant No.4202078) the National Key Project of Science and Technology of China(Grant No.2017ZX02315001-002).
作者简介 Corresponding author:李永亮,E-mail:liyongliang@ime.ac.cn。
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