摘要
为了解决当前采用一维纵向超声加载模式进行芯片键合时造成结合面不充分的问题,设计纵弯复合超声能量加载模式的压电超声换能器,实现轴向纵振和水平弯振复合的超声振动代替传统单一的轴向振动.采用ANSYS软件,对换能器有限元模型进行模态分析和谐响应分析,得到换能器纵振和弯振模态的谐振频率及振型.通过调节换能器结构尺寸,实现纵振与弯振模态的简并.采用阻抗分析仪对样机的频率和阻抗进行测试,使用激光多普勒测振仪测试换能器的纵振与弯振幅值,测试结果与有限元仿真计算结果一致,发现纵向与弯曲振幅均随着驱动电压的增加呈近似线性上升趋势,证明设计的压电换能器实现了纵弯复合振动.
A piezoelectric transducer with longitudinal-flexural composite ultrasonic mode was developed in order to solve the problem that the ultrasonic energy with one-dimensional longitudinal mode causes insufficient bonding area during chip bonding. The transducer can generate composite ultrasonic vibration to replace the conventional longitudinal vibration. The finite element simulation by ANSYS Workbench was employed to conduct the modal analysis and harmonic response analysis of transducer. The resonant frequency and mode shape of the longitudinal and flexural modes were obtained. The longitudinal and the flexural vibration modes were degenerated by adjusting the size of the transducer structure. The frequency and impedance testing of the prototype were conducted by impedance analyzer. The longitudinal and flexural amplitude of the transducer were measured by laser Doppler vibrometer. The experimental results accorded with the finite element calculation. The amplitude of the longitudinal and flexural vibration showed an upward tendency with the increasing of driving voltage. Results prove that the designed transducer can achieve the longitudinal-flexural composite vibration.
作者
胡广豪
薛进学
马文举
隆志力
HU Guang-hao;XUE Jin-xue;MA Wen-ju;LONG Zhi-li(School of Mechatronics Engineering,Henan University of Science and Technology,Luoyang 471003,China;School of Mechatronics Engineering and Automation,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China)
出处
《浙江大学学报（工学版）》
EI
CAS
CSCD
北大核心
2020年第7期1335-1340,1432,共7页
Journal of Zhejiang University：Engineering Science
基金
国家自然科学基金资助项目(U1713206)
深圳市学科布局基础研究资助项目(JCYJ20170413112645981,JCYJ20150928162432701)。
关键词
超声换能器
纵弯复合振动
模态分析
谐响应分析
芯片键合
ultrasonic transducer
longitudinal-flexural composite vibration
modal analysis
harmonic response analysis
chip bonding
作者简介
胡广豪(1995—),男,硕士生,从事芯片键合换能器设计的研究.orcid.org/0000-0002-7452-1170.E-mail:632944546@qq.com;通信联系人:隆志力,男,副教授.orcid.org/0000-0002-7423-5510.E-mail:longzhili@hit.edu.cn。
