摘要
扇出型封装在塑封过程中会出现芯片偏移及翘曲等缺陷,详细了解环氧塑封材料(EMC)的特性能够准确预测封装材料、结构、塑封工艺对塑封效果的影响。针对用于扇出型封装的EMC材料采用动态机械分析仪、差示扫描量热仪、流变仪测试其动态力学性能、固化动力学性能、流变学性能和热容,并建立可用于有限元分析的材料特性数学模型。结果表明,EMC在150℃等温固化60 min后具有最少残余固化;100℃环境下黏度随温度增加速率最快;时温等效原理可预测实验频率以外的力学行为。模型曲线与实验数据的拟合优度均大于0.982,材料表征模型满足准确性与适用性的要求。
Defects such as die shift and warpage may occur in the process of plastic packaging for fan-out package. The impact of packaging materials, structure and molding process on the molding results can be accurately predicted by understanding of the detailed characteristics of epoxy molding compounds(EMC). The dynamic mechanical properties, curing dynamic properties, rheological properties and heat capacity of EMC materials for fan-out packaging were tested using the dynamic mechanical analysis, differential scanning calorimetry and rheometer. The mathematical model of material properties for finite element analysis was established. The results show that the EMC has the minimum residual curing after 60 min isothermal curing at 150 ℃. Viscosity increases the fastest with temperature at 100 ℃. Mechanical behavior beyond the experimental frequency can be predicted by the time-temperature superposition. The goodness of fit between model curve and experimental data is greater than 0.982, and the material characterization model curve meets the requirements of accuracy and applicability.
作者
宗小雪
苏梅英
周云燕
马瑞
曹立强
ZONG Xiaoxue;SU Meiying;ZHOU Yunyan;MA Rui;CAO Liqiang(Institute of Microelectronics of the Chinese Academy of Sciences,Beijing 100029,China;University of Chinese Academy of Sciences,Beijing 100049,China;Shanghai Xianfang Semiconductor Co.,Ltd.,Shanghai 201210,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2020年第5期90-96,共7页
Electronic Components And Materials
基金
国家科技重大专项(2017ZX02315005-001)。
关键词
环氧塑封料
黏弹性
固化动力学
黏度
热容
扇出型封装
epoxy molding compounds
viscoelasticity
curing kinetics
rheological properties
heat capacity
fan-out package
作者简介
周云燕(1980-),女,浙江东阳人,副研究员,博士,研究方向为微电子学与固体电子学;宗小雪(1993-),女,河南安阳人,研究生,研究方向为封装可靠性。
