摘要
激光剥离技术通过脉冲激光辐照致材料烧蚀实现器件向终端基底的转移,具有一定的材料适用性和工艺兼容性,已成为近年来柔性电子器件制造的新兴关键技术。从激光剥离技术的基本机制和工艺特点出发,对激光剥离技术在不同柔性电子器件制造中的研究现状进行调研和介绍,重点阐述激光剥离技术应用中的新工艺与新理论。对激光剥离技术今后的发展方向,特别是超快激光在技术中的应用可能性进行了总结和展望。
Laser lift-off(LLO)is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation.Recently,LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility.Further,the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features,and novel theories and application techniques are given particular emphasis.Accordingly,the application prospects of the LLO technique,especially the possibility of ultrafast laser applications,are summarized and forecasted.
作者
季凌飞
马瑞
张熙民
孙正阳
李鑫
Ji Lingfei;Ma Rui;Zhang Ximin;Sun Zhengyang;Li Xin(Institute of Laser Engineering,Beijing University of Technology,Beijing100124,China;Key Laboratory of Trans-Scale Laser Manufacturing Technology,Ministry of Education,Beijing100124,China)
出处
《中国激光》
EI
CAS
CSCD
北大核心
2020年第1期1-10,共10页
Chinese Journal of Lasers
基金
国家重点研发计划(2018YFB1107500)
国家自然科学基金(51975017,51575013)。
关键词
激光技术
激光材料加工
激光剥离
柔性电子
超快激光
laser technique
laser material processing
laser lift-off
flexible electronics
ultrafast laser
作者简介
季凌飞,E-mail:ncltji@bjut.edu.cn。
