摘要
结合真空电子束气相沉积(electron beam evaporation deposition, EBVD)和磁控溅射(magnetron sputtering deposition, MSD)技术,分别在Al2O3陶瓷衬底上制备以Cu膜为发射层的单一Cu膜和Mo/Cu复合膜及Mo/Ni/Cu复合膜3种结构阴极薄膜。基于二极管场发射器件结构,研究了各样品的场发射特性。利用场发射扫描电子显微镜(field emission scanning electron microscopy, FE-SEM)和能谱仪(energy dispersive spectrometry, EDS)对样品表面形貌和成分进行分析。结果表明:Mo/Ni/Cu复合膜的阈值电场为3.3 V·μm-1;最大电流密度为63.0μA·cm-2;比在相同条件下制备的单一Cu膜和Mo/Cu复合膜具有更好的场发射特性,表明金属复合膜结构有效的改善了单一Cu膜的场发射性能。
Combined with the vacuum electron beam vapor deposition(EBVD) and magnetron sputtering deposition(MSD) techniques, three kinds of cathode films, single Cu film, Mo/Cu composite film and Mo/Ni/Cu composite film, were prepared on alumina(Al2O3) ceramic substrates by taking Cu film as the emitting layer. Based on the structure of diode field emission device, the field emission characteristics of each sample were studied. Field emission scanning electron microscopy(FE-SEM)and energy dispersive spectroscopy(EDS) were used to analyze the surface morphology and composition of the samples. The results show that the threshold electric field of Mo/Ni/Cu composite structure is 3.3 V·μm-1, the maximum current density is 63.0 μA·cm-2. Compared with the single Cu film and the Mo/Cu composite film prepared under the same conditions, the Mo/Ni/Cu composite film show better field emission characteristics, indicating that the metal composite film structure effectively improves the field emission performance of the single Cu film.
作者
王丽军
郭媚媚
王小平
WANG Lijun;GUO Meimei;WANG Xiaoping(College of Science,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处
《有色金属材料与工程》
CAS
2019年第6期1-5,共5页
Nonferrous Metal Materials and Engineering
基金
上海市教委重点创新项目（14ZZ137）
关键词
金属复合膜
场发射
电子束气相沉积
metallic composite film
field emission
electron beam vapor deposition
作者简介
王丽军(1965—),女,副教授。研究方向:固体薄膜材料。E-mail:wljpjchina@163.com,wxpchina64@aliyun.com。
