摘要
针对含有空位缺陷的单晶锗纳米切削过程展开研究,利用分子动力学仿真软件构建了含有空位缺陷的单晶锗切削模型并进行了分子动力学仿真切削。文中从原子角度考虑了切削过程中系统势能的变化、切削力的变化,解释了材料的去除过程和切屑的形成机理,并分析了空位缺陷对切削的影响。结果显示在切削过程中,单晶锗晶体所含空位数越多则基础系统势能越大,且随着切削的进行系统势能逐渐增大。该结果表明空位缺陷的增加会加剧系统的不稳定性。
In order to study the nano-cutting process of monocrystal germanium with vacancy defect,a monocrystal germanium cutting model with vacancy defect was constructed and simulated by molecular dynamics simulation.In this paper,the change of system potential energy and the change of cutting force during cutting process are considered from the atomic point of view.The study explained the material removal process and the formation mechanism of chip,and analyzed the influence of vacancy defect on cutting.The results showed that more vacancies could lead to the increase of system potential energy in the cutting process of monocrystal germanium.This result indicated that the increase in vacancy defects was able to exacerbate system instability.
作者
张逸飞
李珊
杨晓京
吴绍华
刘浩
ZHANG Yifei;LI Shan;YANG Xiaojing;WU Shaohua;LIU Hao(Faculty of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,China)
出处
《电子科技》
2019年第12期53-57,共5页
Electronic Science and Technology
基金
国家自然科学基金(51765027)~~
关键词
分子动力学仿真
切削模型
空位缺陷
单晶锗
系统势能
切削力
molecular dynamics simulation
cutting model
vacancy defect
monocrystal germanium
system potential energy
cutting force
作者简介
张逸飞(1993-),男,硕士研究生。研究方向:微纳米加工;李珊(1965-),女,副教授。研究方向:微纳米切削特性。
