摘要
基于小孔成像原理,利用光沿直线传播这一性质,将受热膨胀的纯铜棒长度的微小变量进行放大,从而确定纯铜棒的线胀系数,并与纯铜棒线胀系数的理论值进行对比,证明了该方法在测量固体材料线胀系数上的可行性。
Based on the principle of pinhole imaging, the tiny variable of length of pure copper bar expanded by heat is amplified by the property of light propagation along a straight line, so as to determine the linear expansion coefficient of pure copper bar.The feasibility of this method in measuring linear expansion coefficient of solid materials is proved by compared with the theoretical value of linear expansion coefficient of pure copper bar.
作者
应杨江
王秀平
刘朋
罗世超
YING Yang-jiang;WANG Xiu-ping;LIU Peng;LUO Shi-chao(School of Electric Power Engineering,Shenyang Institute of Engineering,Shenyang 110136,Liaoning Province;Power Generation Ministry,State GridXinyuan Jilin Songjiang River Hydroelectric Power Co.,Ltd.,Baishan 134500,JilinProvince)
出处
《沈阳工程学院学报（自然科学版）》
2019年第4期377-380,共4页
Journal of Shenyang Institute of Engineering:Natural Science
基金
沈阳工程学院大学生创新实验项目(201811632192)
关键词
小孔成像
线胀系数
固体材料
Pinhole imaging
Linear expansion coefficient
SolidMaterial
作者简介
应杨江(1997-),男,浙江台州人;通讯作者:王秀平(1978-),男,山东青州人,副教授,博士,主要从事新能源技术、特种电机及其控制等方面的研究。
