摘要
针对航天电子产品广泛采用的Sn-Pb焊料在镀金表面焊接形成焊点的工艺,分析了工业及国内外航天相关标准文件中对焊接后焊点中含金量的要求以及焊点含金量、时效、器件不同封装形式对焊点可靠性的影响,并深入分析了合金焊点金相组织结构,最后介绍了一般去金工艺要求与去金不到位而导致器件失效案例。
The process of solder joints on the gold-plated surface of Sn-Pb solder was widely used in aerospace electronics.The requirements of gold content in solder joints after welding in industrial documents and domestic and foreign standards were analyzed.The influences of solder gold content,aging and different packaging forms on reliability of solder joints were analyzed and the metallographic structure of solder joints was discussed.Finally,the requirements of de-golding and failure case of inadequate de-golding were introduced.
作者
周传君
周岭
马娜
王智斌
张绍东
ZHOU Chuanjun;ZHOU Ling;MA Na;WANG Zhihin;ZHANG Shaodong(DFH Satellite Co.,Ltd,Beijing 100094)
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2019年第4期7-10,共4页
Aerospace Materials & Technology
关键词
金脆
含金量
时效
器件封装
去金
Gold embrittlement
Gold content
Timeliness
Packaging
De-gold
作者简介
第一作者简介:周传君,1985年出生,硕士,主要从事卫星工艺、质量技术研究工作。E-mail:zhouchuanjun2004@163.com.
