摘要
对某单片微波集成电路上机工作17个月后在客户端使用时频响不良的原因进行了研究。利用外观检查、 X-ray测试、 I-V特性曲线测试和声学扫描检查等手段对该单片微波集成电路的失效原因进行了具体的分析。通过测试发现样品的失效模式为漏电,内部芯片表面可见钝化层破损,因此推测样品失效与ESD损伤或沟道退化有关。
The causes of bad frequency response of a MMIC when it is used in the elient after 17 months of operation are studied.By means of appearance inspection,X-ray test,I-V characteristic curve test and acoustic scanning inspection,the failure reasons of the MMIC are analyzed in detail.Through test,it is found that the failure mode of the sample is leakage,and the passivation layer of the inner chip surface is damaged.Therefore,it is speculated that the failure of the sample is related to ESD damage or channel degradation.
作者
钱雨鑫
汤仕晖
李进
QIAN Yuxin;TANG Shihui;LI Jin(CEPREI,Guangzhou 510610,China;Ningbo CEPREI IT Research Institute Co.,Ltd.,Ningbo 315040,China)
出处
《电子产品可靠性与环境试验》
2018年第6期15-22,共8页
Electronic Product Reliability and Environmental Testing
作者简介
钱雨鑫(1986-),男,浙江建德人,工业和信息化部电子第五研究所、宁波赛宝信息产业技术研究院有限公司工程师,主要从事可靠性失效分析相关工作.
