摘要
从镀液成分(包括氯化镉、配位剂、光亮剂、辅助剂和氯化钾)、工艺条件(包括pH、温度、阴极电流密度和阳极)及杂质控制3个方面,介绍了氯化钾无氰镀镉工艺的维护经验。用活性炭过滤法处理镀液中的有机物分解产物,用小电流电解法处理铜、铅、铁等金属杂质。
Some experiences on maintenance of potassium chloride cadmium electroplating process were introduced with respect to the bath composition(including cadmium chloride,complexing agent,brightening agent,auxiliary agent,and potassium chloride),operation conditions(such as pH,temperature,cathodic current density,and anode),and impurities control.The decomposition products of organic substances and the metal impurities(such as copper,lead,and iron)need to be removed by filtration with activated carbon and by electrolysis with a small current,respectively.
作者
王大铭
郭崇武
WANG Da-ming;GUOChong-wu(AVIC Liyuan Hydraulics Co., Ltd., Guiyang 550018, China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第23期1099-1101,共3页
Electroplating & Finishing
关键词
氯化钾无氰镀镉
镀液成分
工艺条件
杂质
去除
cyanide-free potassium chloride cadmium electroplating
bath composition
operation condition
impurity
removal
作者简介
王大铭(1986–),男,贵州毕节人,学士,南昌航空大学金属材料工程专业,工程师,从事电镀工艺维护工作。
