摘要
为了得到满足低ESR固体钽电解电容器要求的浸渍银浆,研究了银粉粒径、银含量、有机添加剂表面改性剂与浸渍银浆导电及附着性能的关系,以及浸渍银浆改性对固体钽电解电容器中浸渍银浆阻抗的影响。结果表明,当片状银粉的平均粒径在4~8μm,银含量达到50%(质量分数)时可以得到较低的电阻率,电阻率为2.4×10^(-5)Ω·cm,满足阻抗和浸渍要求;在浸渍银浆使用之前,电容芯预浸渍单烷氧基钛酸酯偶联剂,有利于银层与石墨层之间的附着,并且在浸渍银浆中添加10%(质量分数)石墨浆可降低界面电阻至6 mΩ。
In order to obtain the impregnated silver paste which meets the requirements of low ESR solid electrolytic tantalum capacitor,the correlation between the adhesion,conductive properties and the silver particle,silver content were investigated,as well as the influence of modified impregnated silver paste on impendence.The results show that the resistivity of sliver suspension is 2.4×10^-5Ω·cm when the average particle size of the silver flake is 4-8μm and the silver content is 50%(mass fraction),which meets the requirements of impedance and impregnation.Before the paste is used,the capacitive core prepreg monoalkoxide titanate coupling agent facilitates adhesion between the silver layer and the graphite layer,and 10%(mass fraction)graphite paste added in sliver suspension can reduce the interfacial resistance to 6 mΩ.
作者
庞锦标
杨康
何创创
居奎
杨邦朝
PANG Jinbiao;YANG Kang;HE Chuangchuang;JU Kui;YANG Bangchao(Yunke Electronic Co.,Ltd,Zhenhua Group,Guiyang 550018,China;Guizhou Zhenhua Electronic Information Industry Technology Research Co.,Ltd,Guiyang 550018,China;School of Micro-Electronics and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2018年第8期56-60,共5页
Electronic Components And Materials
基金
贵州省重大专项([2016]3011)
国防基础科研项目(JCKY2016211C007)
贵州省经信委技术创新项目(2017021)
关键词
固体钽电解电容器
浸渍银浆
片状银粉
阻抗
浸渍
界面电阻
solid electrolytic tantalum capacitor
impregnated silver
silver flake
impedance
impregnation
interfacial resistance
作者简介
通讯作者:庞锦标(1984-),男,湖北咸宁人,博士,主要从事电子功能材料及电子元器件的开发。
