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自动测试设备测试接口板可靠性的评审方法与要求 被引量:4

Evaluation Methods and Requirements of Automatic Test Equipment Test Interface Board Reliability
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摘要 测试接口板的可靠性对测试结果的准确性有较大影响,而目前国内外还没有对接口板的可靠性评审做出详细规定。通过对测试接口板结构与功能要求进行分析,确定了测试负载板可靠性、适配座可用性、信号完整性3个一级评审要素。从设计、制作、使用条件、器件选用等角度,将一级评审要素细分出23个二级评审要素,并对这些要素做出详细要求,形成一套适用于自动测试设备测试接口板的评审方法和要求。该方法可有效保障鉴定检验中大规模集成电路测试的可控性,可为军用超大规模集成电路鉴定检验提供测评依据,同时为测试程序的运行提供技术参考。 The reliability of the test interface board has a great influence on the accuracy of test result,but there are no detailed regulations about it in the domestic and overseas.Three primary evaluation factors,the reliability of test load board,the availability of adaptation socket and the integrity of signal were determined by construction and function requirements analysis.23 secondary evaluation factors with detailed requirements were subdivided from primary evaluation factors by design,production,working condition,selection of devices and so on,forming a set of evaluation methods and requirements that suitable for automatic test equipment test interface board.The method can effectively guarantee the controllability of large scale integrated circuit test in the verification test,and can provide the basis for the evaluation of the verification of the military VLSI circuit and provide a technical reference for the operation of the test program.
作者 高成 张明杰 黄姣英 GAO Cheng;ZHANG Mingjie;HUANG Jiaoying(School of Reliability and Systems Engineering,Beihang University,Beijing 100191,China)
出处 《武汉理工大学学报(信息与管理工程版)》 CAS 2018年第1期108-112,共5页 Journal of Wuhan University of Technology:Information & Management Engineering
基金 国家自然科学基金项目(61376042)
关键词 自动测试设备 接口板 可靠性 评审 方法 要求 automatic test equipment interface board reliability evaluation methods requirements
作者简介 高成(1972-),男,内蒙古赤峰人,北京航空航天大学可靠性与系统工程学院教授,主要研究方向为元器件可靠性评价、测试和分析.;通讯作者:黄姣英(1977-),女,湖南邵阳人,北京航空航天大学可靠性与系统工程学院高级工程师,主要研究方向为电子元器件可靠性.
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  • 1许继平,王英强,王小艺,姜思月.安全阀年检网络管理系统设计与实现[J].中南大学学报(自然科学版),2013,44(S1):411-414. 被引量:1
  • 2程萍,陈静.研究生培养经费管理系统设计与实现[J].武汉理工大学学报(信息与管理工程版),2007,29(1):87-90. 被引量:3
  • 3Miek S, Wilson J, Franzon P. 4 Gbps High-density AC Coupled Intereonnection [ C]//IEEE Custom Integrated Circuits Conference (CICC). Florida: IEEE, 2002: 133-140.
  • 4Chandrasekar K, Feng Z, Wilson J, et al. Inductively Coupled Board-to-board Connectors [ C]//IEEE Electronic Components and Technology Conference ( ECTC). Florida: IEEE, 2005 : 1109-1113.
  • 5Jang B H, Huang H Y, Fang W. A Novel Zero-insertion-force (ZIF) Micro (μ)-connector: Design, Fabrication, and Measurements [ J]. IEEE Trans on Industrial Electronics, 2009, 56(4): 1040-1047.
  • 6Xu J, Mick S, Wilson J, et al. AC Coupled Interconnect for Dense 3-D ICS [ J]. IEEE Trans on Nuclear Science, 2004, 51 (5) : 2156-2160.
  • 7Erickson E, Wilson J, Chandrasekar K, et al. Multi-bit Fractional Equalization for Multi-Gb/s Inductively Coupled Connectors [C]//IEEE EPEPS: 18. Washington: IEEE, 2009: 121-124.
  • 8张肇仪,周乐柱,吴德明.微波工程[M].3版.北京:电子工业出版社,2006:290-293.
  • 9Bierhoff T, Schrage J, Halter M, et al. All Optical Pluggable Board-backplane Interconnection System Based on an MPXTM- FlexTail Connector Solution [ C]//IEEE PHOTWTM. Majorca: IEEE, 2010: 91-92.
  • 10李玉山,潘建.高速系统设计--抖动、噪声和信号完整性[M].北京:电子工业出版社,2009:173-187.

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