摘要
采用机械共混法制备二苯基/单苯基硅橡胶并用胶,研究了二苯基/单苯基硅橡胶质量比对胶料低温、高温性能的影响。结果表明,随单苯基硅橡胶用量的增大,胶料的低温性能和高温性能均有明显改善,当质量比为70/30时,低温性能最好,-70℃时压缩耐寒系数达到0. 79;同时320℃×24 h热空气老化后的拉伸强度变化率、拉断伸长率变化率和220℃×48 h、300℃×4 h高温压缩永久变形降低,提高了胶料耐高温性能;通过对两种不同壁厚的Ω型和桃心型密封型材在-120~300℃超宽温域范围内压缩回弹性能的研究,发现采用Ω型且壁厚为1. 0 mm的低应力密封结构的压缩回弹保持率最好,进一步制得能在-120~300℃宽温域范围内压缩28%时,压缩回弹力小于3 N/cm的密封型材。
The Diphenyl/monophenyl silicone rubber blends were prepared by mechanical blending, and the effect of the mass ratio of diphenyl/monophenyl silicone rubber on the low and high temperature properties of the compound at low and high temperature was studied. Results showed that the low and high temperature properties of the compounds were greatly improved with the increase of the amounts of monophenyl silicone rubber, when the mass ratio was 70/30, the performance at low temperature of the rubber was the best, the coefficient of compression cold resistance reached 0.79 at -70 ℃. At the same time, the change rate of tensile strength and elongation at break after aging in hot air at 320℃×24 h, and compression set at 220℃× 48 h and 300℃×4 h were decreased, which improved the high temperature resistance of the compounds. The compressive resilience properties of type Ω and peach core sealing profiles with different wall thickness in the ultra-wide temperature range of -120℃ to 300℃ were studied. It was found that the compression resilience retention rate of the low stress seal structure with type Ω and wall thickness of 1.0 mm was the best. Thus the sealing profile was prepared with a compression resilience less than 3 N/cm when compressed at 28% in a wide temperature range of -120℃ to 300℃.
作者
雷海军
张骥忠
宫文峰
翟广阳
王鑫
LEI Hai-jun;ZHANG Ji-zhong;GONG Wen-feng;ZHAI Guang-yang;WANG Xin(Northwest Rubber and Plastics Research ＆ Design Institute Co.,Ltd.,Xianyang 712023,Shanxi)
出处
《有机硅材料》
CAS
2018年第6期455-458,共4页
Silicone Material
关键词
二苯基硅橡胶
单苯基硅橡胶
超宽温域
压缩回弹力
diphenyl silicone rubber
monophenyl silicone rubber
ultra -wide temperature range
compression resilience
作者简介
雷海军（1968-），男，副总工程师，主要从事橡胶配方和密封制品的开发工作。E—mail：lhjemail@163．com。
