摘要
采用化学镀锡提升印制电路板电子线路的表面平整、可焊性与抗腐蚀性受到业界广泛关注。本文采用硫酸体系化学镀锡工艺,研究了施镀时间对锡镀层厚度、形貌的影响,并用SEM、XRD对镀层形貌成分进行表征。在三电极体系中分别研究了不同浸镀时间和退火对含锡镀层在0.5mol·dm^(-3)氯化钠溶液中的电化学腐蚀行为的影响,结果表明,退火可以增加镀层中锡铜合金的含量,降低腐蚀电流,有效的提高镀层的抗蚀性。
The flat surface and solderability and corrosion resistance of the Electronic Circuit are improved by electroless tin plating for PCB which is widely concerned. This paper adopts electroless tin plating in sulfuric acid, and studies the influence of plating time on the thickness and morphology of tin coating. It uses the SEM and XRD to characterize the morphology and composition of coating. The electrochemical corrosion behavior of tin coating in 0.5mol·dm-3 Sodium Chloride Solution is investigated in the Three electrode systems. The results show that the annealing could increase the content of tin copper alloy of the coating and reduce the corrosion current, and improve the corrosion resistance of coating effectively.
作者
高箐遥
王守绪
陈苑明
何为
陈世金
GAO Qing-yao;WANG Shou-xu;CHEN Yuan-ming;HE Wei;CHEN Shi-jin
出处
《印制电路信息》
2018年第4期14-20,共7页
Printed Circuit Information
基金
2015年广东省科技计划项目(No.2015B090901032)
广东省"扬帆计划"引进创新创业团队项目(No.2015YT02D025)
关键词
化学镀
形貌
锡铜合金
电化学腐蚀
退火
施镀时间
Electroless Plating
Morphology
Sn-Cu Alloy
Electrochemical Corrosion
Annealing
Plating Time
作者简介
高箐遥，在读硕士研究生，主要从事印制电路板镀锡方面的研究。
