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橡胶贴膏剂制备方法的应用分析 被引量:14

Analysis of Application of Adhesive Plaster Preparation Method
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摘要 橡胶膏剂有溶剂法和热压法2种制备方法。溶剂法生产的产品黏性好、皮肤残留物少,但生产过程使用了溶媒,存在安全隐患和环境污染等问题;热压法生产橡胶膏剂,取消了溶媒,安全、环保、占地面积小、成本低、挥发性药物损失少、老化慢、生产周期短、生产效率高,热压法代替溶剂法生产橡胶膏剂是发展趋势。橡胶膏剂的涂胶工艺分为直涂法和反涂法2种,直涂法对布匹要求高,生产时胶面容易产生黏连等问题;反涂法操作简单、含膏量稳定、生产效率高,可应用四面弹性布做衬材。降低橡胶基质软化温度并且保证其耐热性能是实现反涂热压法生产橡胶膏剂的关键,调整基质中软化剂、增粘剂、橡胶等用量比例,能够实现热压法产品在光泽度、初粘性、持粘性、内聚力等方面与溶剂法相似。 Adhesive piaster has two kinds of preparation methods, such as solvent method and hotpressing method. Products produced with solvent method have good viscosity and less skin residue. However, there are some potential dangers and the process will result in environmental pollution owing to using solvent. On the other hand, the adhesive plaster produced with hot-pressing method, because of no solvent, is secure and environmental with less land occupation, low cost and so on. In a word, adhesive plaster produced with hotpressing method can be instead of solvent method. The coating technologies of adhesive plaster have direct coating and back-coating, direct coating has high demand for cloth, and surface of plaster will easily lead to some problems, like adhesion in the process of production; but back-coating is easy to operate, and the products have stable paste content with high production efficiency. The key to achieving producing adhesive plaster with hot-pressing method and back-coating is to reduce the softening temperature of rubber matrix and keep the heat-resistant quality. Adjustment the dose of softener, tackifier and others in rubber matrix can make the products with hot-pressing method to be similar to those with solvent method in glossiness, initial adhesion, persistent adhesion and so on.
作者 王永刚
出处 《中国实验方剂学杂志》 CAS CSCD 北大核心 2017年第13期231-234,共4页 Chinese Journal of Experimental Traditional Medical Formulae
关键词 橡胶膏剂 热压法 溶剂法 反涂法 直涂法 生产工艺 adhesive plaster hot-pressing method solvent method back-coating direct coating production process
作者简介 [通讯作者]王永刚,高级工程师,从事贴膏基质和贴膏制剂工艺的研究与应用,Tel:13609874367,E-mail:yg200567@163.com
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