摘要
孔无铜是造成印制电路板产品报废的常见缺陷之一,具有功能性影响。文章利用切片显微方法、万孔实验、正交试验法,结合PCB孔金属化流程,研究了PCB出现批量性孔无铜的原因,提出了一些改善措施,并通过效果追踪验证了改善措施的可行性。
Having no copper in the holes is one of the common defects that results in scrap of the PCB and the functional infl uences. In this paper, the cause of having no copper in the holes in batches of the PCB was studied by using the microscope slice method and by the thousands of holes test and the orthogonal experiment, and combining the process of hole metallization of PCB. Some improvements were then put forward and confi rmed by a tracking study.
出处
《印制电路信息》
2016年第6期43-46,共4页
Printed Circuit Information
关键词
印制电路板
孔金属化
电镀
孔无铜
正交实验法
PCB
Hole Metallization
Electroplating
Having No Copper in the Holes
Orthogonal
作者简介
徐文中，2006年开始从事线路板行业，现任江门崇达电路技术有限公司工艺高级工程师，主要负责电镀（沉铜、板电、图电、蚀刻）工序新物料、新设备评估、技术能力提升及日常工艺维护等工作。
