摘要
以ARM芯片为核心,根据芯片特性并搭配经过改进的双内核Linux操作系统,设计出一种具备良好性能且价格较低的嵌入式软PLC。介绍了嵌入式软PLC的系统结构,阐述了操作系统的选择与改进及运行系统的构建流程,并以常规电镀生产流程控制为例,对嵌入式软PLC的应用效果进行了评价。测试结果表明:嵌入式软PLC的主要性能指标均较好,满足电镀生产流程控制要求。
An embedded soft PLC featuring excellent performance and lower price was designed, in which ARM chip was used as the core, and the double-kernel Linux operating system improved according to chip characteristics was selected as the operating system. The system structure of embedded soft PLC was introduced, and the selection as well as improvement of operating system and the construction procedure of running system were also elaborated. Moreover, the application effect of embedded soft PLC was evaluated taking conventional electroplating production process control as an example. Tests showed that the main performance indexes of embedded soft PLC were desirable, indicating that the embedded soft PLC meet electroplating production process control requirements.
出处
《电镀与环保》
CAS
CSCD
北大核心
2016年第3期54-57,共4页
Electroplating & Pollution Control
关键词
控制系统
电镀生产流程
嵌入式软PLC
拓展性
control system
electroplating production process
embedded soft PLC
expansibility
