摘要
基于有限单元法研究PBGA封装无铅SAC405焊点在-55～125℃热循环中的可靠性,探讨了温度效应对其应力应变分布的影响,分析了焊点裂纹的成长情况。结果表明：温度效应对PBGA封装的应力、应变分布具有一定影响;焊点的等效应力最大值位于焊点的上表面,关键焊点是对应于芯片距离对称中心最远处的焊点;裂纹形成在基板侧,沿着焊盘由焊点的外侧向内侧扩展。试验结果与模拟结果一致,验证了模拟结果的正确性。
In order to study the reliability of the lead-free SAC405 solder joints for the PBGA packaging under the thermal cycle between-55 ℃ and 125 ℃, the finite element method was used to discuss the influence of the thermal effect on the stress and strain distribution of solder joints, and the crack growth was also analyzed. The results showed that:( 1) thermal effect had certain influence on the stress and strain distribution of PBGA packaging;( 2) the maximum equivalent stress of solder joints located on its upper surface, and the critical solder joints was corresponding to the most distant distance from the symmetrical center of the chip;( 3) the cracks formed on the substrate side, expanded from the outside to the inside of the solder joints along the bonding pad. Test results were consistent with the simulation results, which verified the validity of the simulation results.
出处
《焊接技术》
2016年第4期8-11,5,共4页
Welding Technology
基金
河南工业大学高层次人才资助基金(150470)
关键词
焊点
塑料球栅阵列封装
温度效应
可靠性
solder joints
plastic ball grid array
thermal effect
reliability
作者简介
任宁（1981-），女，博士，副教授，主要从事电子封装可靠性、机械CAE方面的研究，发表论文20余篇，获得软件著作权1个，获得专利4项．
