摘要
在微系统中,粗糙表面间的黏着力是影响微尺度对象能否成功装配的主要因素。为研究微尺度对象粗糙表面的接触机理,将Maugius理论和分子作用的Kim物理接触理论相结合,建立了微尺度对象的多峰黏着弹性接触模型,应用三维分形几何进行黏着力的求解,并对Kim物理接触黏附半径做近似计算,且将新建模型与不考虑分子作用力的Morrow模型进行比较。分析结果表明:微凸体两粗糙表面的物理接触距离越小,对黏着影响越大;分形维数增加,微凸体物理接触的黏着作用显著增加;随着分形粗糙度减小,Kim物理接触的微凸体数目明显增多,黏着力显著增加。
The adhesion force that exists in Micro Electro Mechanical Systems（MEMS） is a major failure mode for microscale ob- jections during manipulation. The multiasperity elastic adhesion contact model is presented by combing Maugius＇ theory with Kim physical contact theory. In order to compute adhesion force of the model by fractal geometry, the adhesion contact radius of Kim theory is approximated. It is compared the adhesion force of new model with that of Morrow model. The result indicates that, rough surfaces of two asperities is the smaller physical contact distance and the greater adhesion force; when fractal dimension is in- creased, adhesion force of physical contact for asperity is obviously increased;when fractal roughness is decreased, in the number of asperities of Kim physical contact and adhesion force are greatly increased.
出处
《现代制造工程》
CSCD
北大核心
2016年第4期152-156,共5页
Modern Manufacturing Engineering
基金
内蒙古自然科学基金项目(2012MS0730)
关键词
微系统
微凸体
黏着接触
分形几何
物理接触
microsystem
asperity
adhesion contact
fractal geometry
physical contact
作者简介
作者简介：苗淑静，讲师，硕士，研究方向为微机电系统。E-mail：miaoshj2008@163．com
