摘要
针对高铁、飞机等高速运行设施对动态压力监测提出的要求,研制了一种压阻式微电子机械系统（MEMS）超薄动态压力传感器。采用有限元分析（FEA）软件ANSYS对5种压力传感器芯片结构进行了仿真对比分析,结合MEMS加工工艺,设计的传感器芯片采用线性好、灵敏度高、固有频率高的单岛膜结构。利用硅通孔（TSV）技术对传感器抗冲击、防水、可靠性等性能进行了优化设计,采用硅微MEMS工艺加工了动态压力传感器芯片,并完成了传感器的超薄封装,最终厚度为0.9~1 mm。对传感器的基本性能、耐冲击、防水特性进行了测试,结果表明传感器的基本性能良好,非线性度为0.076%满量程输出（FSO）,灵敏度为0.23 mV/kPa/V,非重复性为0.041%FSO,并且可抗20 000g冲击,达到5级防水。
A piezoresistive micro-electromechanical system（MEMS）ultrathin dynamic pressure sensor was designed for monitoring high speed equipments,such as high speed rails and aircrafts.Five kinds of pressure sensor chip structures were simulated by finite element analysis（FEA）tool ANSYS.Based on MEMS technology,the single island-membrane structure with good linearity,high sensitivity and high natural frequency was used in the designed sensor chip.The shock resistances,waterproof,reliability of the sensor were optimized by the through silicon vias（TSV）technology.The dynamic pressure sensor chip was fabricated by MEMS technology and the ultrathin packaging of the sensor was completed.The final thickness of the sensor is 0.9-1 mm.The basic performance,shock resistance and waterproof of the sensor were tested.The results show that the basic performance of the sensor is good.The nonlinearity,sensitivity,nonrepeatability,shock resistance and waterproof of the sensor are 0.076%full scale output（FSO）,0.23 mV/kPa/V,0.041%FSO,20 000 gand 5 grade,respectively.
出处
《微纳电子技术》
北大核心
2016年第4期249-254,共6页
Micronanoelectronic Technology
关键词
微电子机械系统(MEMS)
超薄封装
高频响应
抗冲击
防水
micro-electromechanical system（MEMS）
ultrathin package
high resonance frequency
shock resistance
waterproof
作者简介
E-mail：wz．wang@mtmems．com.王伟忠（1984-），男，河北石家庄人，博士，工程师，主要从事MEMS压力传感器的研发工作。
