摘要
采用半导体激光软钎焊和红外再流焊对QFP256和0805片式电阻进行钎焊试验,研究了SnAgCuCe焊点的力学性能、热疲劳寿命以及显微组织。结果表明,在激光再流焊条件下,激光输出功率对SnAgCuCe焊点的力学性能存在显著影响,且存在最佳值。在热循环载荷作用下,随着热循环次数的增加两种焊接方式下焊点的力学性能均呈明显下降趋势,SnAgCuCe激光再流焊焊点的疲劳寿命明显高于SnAgCuCe红外再流焊焊点,主要是因为激光快热/快冷导致焊点内部物相尺寸较小,组织明显细化。
Welding experiments for QFP256 and 0805 rectangular chip resistor components were carried out by diode la- ser soldering system and IR reflow soldering method, respectively, the mechanical properties, thermal fatigue life and micro- structures of SnAgCuCe solder joints were investigated. The results show that the mechanical properties of solder joints is influ- enced remarkably by laser output powers, and there is an optimal output power according to the best mechanical properties. During thermal cycling testing, the mechanical properties decrease gradually with the increasing of thermal cycling loading, the fatigue life of solder joints with laser soldering is higher than that of IR solder joints, which attributes to the rapid heating/cool- ing results in the small phases and refined microstructure.
出处
《稀土》
EI
CAS
CSCD
北大核心
2015年第6期91-95,共5页
Chinese Rare Earths
基金
江苏省自然科学基金(BK2012144)
江苏省高校自然科学基金(12KJB460005)
江苏科技大学先进焊接技术省级重点实验室开放研究基金(JSAWS-11-03)
江苏师范大学自然科学基金(11XLR16)资助项目
关键词
激光再流焊
无铅焊点
激光功率
疲劳寿命
diode laser soldering
lead free solder joints
laser output powers
fatigue life
作者简介
张亮（1984-），男，安徽灵璧人，博士，副教授，研究方向：新型钎焊材料、微电子封装材料与工艺和焊点可靠性。通讯联系人（E-mail：zhangliang@jsnu．edu．cn；zhangliang@nuaa．edu．cn）
