摘要
采用二烯丙基双酚A和二苯甲烷型双马来酰亚胺与双酚A型氰酸酯共聚,以改善氰酸酯树脂的工艺和耐热性能;利用DSC,TGA,DMA表征了树脂的固化行为和耐热性能;此外,还研究了树脂的力学性能及高频下的介电性能。结果表明,改性后的氰酸酯树脂固化反应温度降低了约60℃,改性树脂固化物在氮气气氛下Td5约400℃,Tg约270℃,显示了良好的耐热性能。在7~15 GHz宽频范围下,改性树脂的介电常数〈3,介电损耗0.008~0.01,显示了良好的介电性能。
In this paper, diallyl bisphenol A and N, N＇-（4,4＇-diphenylmethane）bismaleimide were used to modify bisphenol A diseyanate ester to improve process capability and heat resistance. Cure behavior and heat resist- anee of the modified resin was investigated by differential scanning calorimetry （ DSC ）, thermogravimetric analysis （TGA） and dynamic mechanical analyzer （DMA）. In addition, mechanical properties and dielectric properties in high frenquency of the resin were also investigated. The result indicated that DSC result showed that the temperature of the curing reaction of modified resin was lowedca 60℃. TGA results showed 5% weight loss temperature were about 400℃. DMA results showed the inflection point of tarδare about 270℃. In 7 to 15 GHz, the dielectric constant 〈3, dielectric loss 0.008 to 0.01, showing a good dielectric properties.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2015年第6期45-48,共4页
Aerospace Materials & Technology
基金
青年科学基金项目(项目编号:51403218)
关键词
氰酸酯
双马来酰亚胺
介电性能
Cyanate ester, Bismaleimide, Dielectric property
作者简介
郭颖，1985年出生，博士，主要从事耐高温高分子的相关研究。E-mail：gsummer@iccas．ac．cn
