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高厚度铝基微波印制板加工技术的研究

Research of high thickness aluminum based microwave printed board processing technology
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摘要 铝基厚度在5mm以上,绝缘层为聚四氟乙烯,厚度超过0.5mm。作为高频微波通信用线路板。这类板子在加工中主要存在三个问题:首先,板子厚、散热差、孔边毛刺大、披峰严重,钻孔时断刀率高;其次,铣铝基外形和盲槽难度大、铣削效率低,严重影响生产效率;再次,蚀刻时,溶液侵蚀铝基面。本人通过扎实的理论基础与反复的工艺试验,最终解决了高厚度铝基微波板在机械加工过程中的技术难题,最终达到稳定量产的技术水平。 The structural characteristics of this plate is that the thickness of aluminum is above 5mm, andthe insulation layer is PTFE, and the thickness is over 0.5mm. It is a high frequency microwave communicationcircuit hoard. This kind of bat in the processing has mainly three issues first of all, plank, poor heat dissipation, thebun" hole big, Phi peaks are seriously, high rate of drilling TBknife; secondly, milling aluminum base shape and theblind grooves difficulty is big, the milling efficiency is low, which seriously affect the production efficiency; thirdly,etching solution aluminum surface erosion. Through solid theoretical foundation and repeated experiments, I finallysolved the technical problems in the machining process of high thickness aluminum based microwave printedboards eventually reached a steady production of the technical level.
出处 《印制电路信息》 2015年第11期55-58,共4页 Printed Circuit Information
关键词 铝基板 钻孔 铣削 Aluminum Substrate Drilling Milling
作者简介 纪龙江,技术中心副主任。 姜曙光,总经理。 王俊浩,厂长。
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参考文献2

  • 1林金堵等.现代印制电路先进技术第三版[M].2013,2.
  • 2纪龙江等.420gm超厚铜线路板钻孔加工技术研究[G].2012春季国际P(B技术/信息论坛.

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