摘要
旋涂法是光刻工艺中涂胶的重要方法,在旋涂经典EBP方程和考虑挥发与转速关系的溶剂挥发模型基础上,通过数值模拟对溶剂挥发模型提出的过渡点增加了动态参数因子补偿,得出更合理的膜厚拟合方程。通过自制的旋涂验证装置进行光刻涂胶实验并采集相关实验数据来验证拟合方程的正确性。利用该优化的拟合方法来指导实践,可制定更为合理的实际工艺参数。
The spin coating method was an important method for photoresist coating in the photo-lithography process.Based on the mode of the classical EBP equation and solvent evaporation mode which considered the relationship between the solvent evaporation and spin speed,and the dynamic pa-rameter compensation was added through the numerical simulation of the transition point to get a fur-ther modified equation.The validity of the modified equation was verified by the experimental data collected by the lab made spin coating device.More reasonable process parameters can be obtained with this optimized fitting method.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2015年第6期733-736,742,共5页
China Mechanical Engineering
基金
国家科技重大专项(2012ZX02102)
关键词
旋涂
动态补偿因子
溶剂挥发
膜厚
spin coating
dynamic compensation factor
solvent evaporation
film thickness
作者简介
刘学平，男，1965年生。清华大学深圳研究生院先进制造学部副研究员。主要研究方向为机电控制、绿色设计与绿色制造。获省部级科技进步一等奖1项，发表论文30余篇。
郑钢，男，1989年生。清华大学精密仪器与机械学系硕士研究生。
