摘要
研究不同固溶处理后GH864合金650℃裂纹扩展速率的变化规律。结果表明:随晶粒尺寸和固溶温度增加,裂纹扩展速率呈先降低后增加的趋势。根据多组试验数据拟合得到GH864合金晶粒尺寸与裂纹扩展速率的关系式,预测GH864合金晶粒尺寸在100μm左右,抗裂纹扩展能力可能存在最佳值。同时得到GH864合金固溶温度与裂纹扩展速率的关系式。用不同固溶温度将裂纹扩展速率变化规律划分为5个区域,低于固溶温度1080℃裂纹扩展速率随固溶温度增加而降低,1080℃固溶处理后合金的裂纹扩展速率最低,高于固溶温度1080℃裂纹扩展速率随固溶温度增加而增加。精准控制固溶温度可得到合适的晶粒尺寸和较好抗裂纹扩展能力。
The effect of the solution treatment on the crack growth rate regularity of GH864 alloy was studied at 650 oC.The results indicated that the crack growth rate firstly decreases and then increases with increasing grain size and solution temperature.The relationship between grain size and the crack growth rate was fitted according to milt-group test data.It is predicted that the crack growth resistance may have an optical point when the grain size reaches 100 μm.The relationship between solution temperature and the crack growth rate of GH864 alloy was concluded.The crack growth rate regularity of GH864 alloy is divided into five areas by different solution temperatures.The crack growth rate is decreased with increasing the solution temperature when the solution temperature is below 1080 oC,and the lowest occurs at the solution temperature 1080 oC while the rate is increased with increasing the solution temperature when the solution temperature is higher than 1080 oC.The crack growth resistance may be obtained by precisely controlling solution temperature and grain size.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2014年第10期2502-2506,共5页
Rare Metal Materials and Engineering
基金
国家自然科学基金(50771011)
作者简介
王璞，女，1982年生，博士，安泰科技股份有限公司精细金属制品分公司，北京101318，电话：010—80485825，E—mail：wangpu8212@yahoo．com．cn
