期刊文献+

基于混合曝光技术的新型亚微米图形制作方法

A New Fabrication Method of the Sub-Micron Pattern Based on the Mixed Exposure Technology
在线阅读 下载PDF
导出
摘要 提出了一种基于投影式光刻机和电子束光刻机混合曝光技术的新型亚微米图形制作方法,该方法可用于制作对精度要求比较高的亚微米图形。具体的做法是将亚微米图形分解成高精度图层和普通精度图层,并将两个图层分别采用电子束直写和投影式光刻机依次在同一层光刻胶曝光后,经过一次显影得到完整图形。通过该方法不仅可以大幅减少采用电子束直写亚微米图形所需的时间,还可以有效地保证图形的线宽精度。从图形的数据处理和实验制作两个方面,详细地介绍了采用该方法在硅衬底上制作SU-8亚微米图形的过程。经SEM测试得出,本方法制作的图形尺寸精度和棱角的锐度都非常精确,可比较理想地实现设计者的设计要求。 Based on the mixed exposure technology of the projection lithography system and elec tron beam lithography system, a new fabrication method was presented for making high precision submicron pattern. The submicron pattern was divided into high precision one and low precision one, then the two patterns were respectively exposed by electron beam lithography system and projection lithography system on the same layer of the photo resist in proper order, and the whole pattern was obtained after a development. The method can greatly reduce the time of the electron beam directwrite and effectively assure the linewidth precision of the pattern. From two aspects of data processing and experiment, the fabrication process of the SU 8 submicron pattern on the silicon substrate by the method was introduced. The SEM test result shows that the method can fabricate the SU 8 pattern with very high size precision and angle acutance, and ideally realize the design requirements of the designers.
出处 《微纳电子技术》 CAS 北大核心 2014年第7期475-478,共4页 Micronanoelectronic Technology
基金 江苏省高等职业院校高级访问工程师计划资助项目(2013-FG012)
关键词 混合曝光技术 亚微米图形 电子束曝光 投影式光刻 SU-8 mixed exposure technology sub-micron pattern electron beam lithography projec-tion lithography SU - 8
作者简介 李淑萍(1972-),女,山西汾阳人,微电子技术专业主任。副教授,目前主要从事IC制造工艺研究: 林文魁(1984-),男,福建泉州人,硕士,研究实习员,目前主要从事微纳米加TT艺的研究。
  • 相关文献

参考文献8

二级参考文献48

  • 1[1]CREMERS C, BOUAMRANE F, SINGLETON L, et al. SU-8 as resist material for deep X-ray lithography [J]. Microsystem Technologies 2001,7 (1):11-16.
  • 2[2]LORENZ H, DESPONT M, VETTIGER P, et al. Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist [J]. Microsystem Technologies 1998,4 (3):143-146.
  • 3[3]LEE K Y, LABIANCA N, RISHTON S A, et al. Micromaching application of a high resolution ultrathick photoresist [J]. J Vac Sci Technol B,1995,13(6).
  • 4[4]DESPONT M, LORENZ H, FAHRNI N, et al. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist for MEMS applications [A]. Proc of the 10th Int IEEE Workshop on Micro Electro Mechanical Systems [C]. Nagoya, Japan, 1997, 518-522.
  • 5SUEMITSU T,ENOKI T,YOKOYAMA H,et al.Improved recessed-gate structure for sub-0.1-mum-gate InP-based high electron mobility transistors[J].Japanese Journal of Applied Physics:Part 1,1998,37 (3B):1365-1372.
  • 6READINGER E D,MOHNEY S E,PRIBICKO T G,et al.Ohmic contacts to Al-rich n-AlGaN[J].Electronics Letters,2002,38 (20):1230-1231.
  • 7WU Y F,MOORE M,SAXLER A,et al.40-W/mm double field-plated GaN HEMTs[C]// Proceedings of Device Research Conference.State College,USA,2006:151-152.
  • 8HIGASHIWAKI M,MIMURA T,MAISUI T,et aL AlGaN/GaN heterostructure field-effect transistors on 4H-SiC substrates with current-gain cutoff frequency of 190 GHz[J].Applied Physics Express,2008,I (2):21103-21105.
  • 9CHUNG J W,HOKE W E,CHUMBES E M,et al AlGaN/GaN HEMT with 300-GHz fmax[J].IEEE Electron Device Letters,2010,31 (3):195-197.
  • 10SZE S M,NG K K.Physics of semiconductor devices[M].New York:Wiley-Blackwell,2007,395-396.

共引文献28

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部