摘要
微流控芯片实验室的成品率普遍较低,其中密封技术是微流控芯片制造过程的关键步骤,也是难点之一。玻璃等硬质材料常通过热键合和阳极键合技术实现密封,而节能省时的低温玻璃键合技术更受科研人员的青睐。此外,胶黏剂键合和表面改性键合以其便捷性和实用性的优势成为玻璃和聚合物芯片键合领域重要的部分。常用的聚二甲基硅氧烷(PDMS)和聚甲基丙烯酸甲基(PMMA)高聚物材料则依据其不同的适用场合而采用不同的键合方式。介绍和分析了微流控芯片领域常用的玻璃、PDMS和PMMA材质键合方式,为微流控芯片制备方法提供了技术指向,对提高微流控芯片制作的成品率产生积极的影响。
The yield of microfluidic chips in lab is generally low,which is mainly caused by the critical steps in the fabrication process,i. e. the bonding or sealing techniques,they are also one of most difficult issues. The thermal bonding and anodic bonding are commonly utilized for the glass and other hard materials,and the low temperature glass bonding technique is another normally used technique by the researchers as an energy-efficient and time-saving technique. Besides that,the adhesive bonding and surface modification bonding become an important part in the bonding field of the glass and polymer chip for their convenience and practicality. As to polymer materials,such as the polydimethylsiloxane（ PDMS） and polymethyl methacrylate（ PMMA）,the bonding methods are selected according to the application circumstance of the microfluidic chip. The commonly used bonding techniques of the glass,PDMS and PMMA materials in the microfluidic chip field are presented and analyzed,which provides technique directions for the fabrication methods of the microfluidic chip,and has a positive impact on the improvement of the yield of the microfluidic chip.
出处
《半导体技术》
CAS
CSCD
北大核心
2014年第7期481-487,共7页
Semiconductor Technology
基金
国家科学仪器重大专项资助项目(2011YQ15004010)
北京分子科学国家实验室开放课题基金资助项目(2013048)
河南理工大学博士基金资助项目(B2013-071)
作者简介
韩建华（1984-），男，山西大同人，博士，主要研究方向为微流控芯片以及电化学分析
通信作者：李少华（1980-），男，湖北松滋人，博士，硕士生导师，主要研究方向为微型反应器、PM2．5检测分析、水质检测分析以及分析仪器和设备。E-mail：lishaohua@iccas．ac．cn
