摘要
本文介绍了在对准式红外倒焊机中采用Intel-8031单片微机实现温度控制的原理,论述了控温系统的软硬件设计。
Basic principles and methods of a structure of an attemperation using an Intel-8031 monolithic microcompter are introduced in this paper. The structure can be used in the adjusting infrared flip-chip bonder. Alse, the design of software and hardware is analysed.
出处
《云南大学学报（自然科学版）》
CAS
CSCD
1991年第2期158-164,共7页
Journal of Yunnan University(Natural Sciences Edition)
