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退火对大剂量Al离子注入GaN发光特性的影响 被引量:1

Annealing Effects on Luminescence Properties of Aluminum-implanted GaN
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摘要 首次报道了用不同浓度的Al离子注入于蓝宝石衬底上的GaN薄膜(注入能量为500keV、注入浓度为1014~1015 cm-2),  在做了不同温度和不同时间的快速热退火处理以及常规热退火处理后,在12K下用He-Cd 激光(325nm)激发得到其发射谱。结果显示, 经大剂量Al注入后的样品,其光致发光谱中3.45eV的带边激子发光以及2.9 ~ 3.3eV的4个声子伴随峰消失。此表明大剂量Al注入对GaN的晶体结构造成严重的损伤,以致本征发光消失。经1014cm-2剂量Al注入后的样品,在N2气氛中退火处理后,2.2eV缺陷发光峰得到了一定程度的恢复。而且,经常规退火处理后,此发射峰比快速退火处理的样品发射峰恢复得更好(其积分光强高3倍)。相似的结果亦显示于1015 cm-2 浓度的Al 注入的样品。2.2eV 黄色荧光源于GaN的缺陷(如Ga空位(VGa), 或VGaH2,或VGa-ON 复合体),其能级位于价带顶以上约1.1eV处。荧光发射可以来自"导带缺陷能级"的跃迁,也可能来自浅施主(如N位O,能级位于导带下~10 meV)至上述缺陷能级之间的跃迁。I-V 测量显示,Al的注入区成为 ~ 10? Ion implantation is one of the most commonly used processes in semiconductor technology. It is particularly useful for achieving a laterally varying doping concentration profile across a semiconductor wafer or a film. Al has been widely used in producing ternary compound AlxGa1-x N, which is very important in such devices as high temperature transistors and UV detectors. However, it appears that study concentrated on Al implantation into the GaN and related devices has not yet been made. It is main aim of this paper to report on some such studies of the optical characteristics of Alimplanted (implantation energy and dose: 500keV and 1014- 1015cm-2, respectively) GaN grown on sapphire. Photoluminescence (FL) spectra taken at 12K on as-grown and implanted GaN show that the band edge exciton emission (corresponding 3. 45eV) and four phonon replica peaks ( 2. 97-3. 25eV) disappear for the implanted samples even after annealing, which suggests that it is the high-dose implantation that causes serious damage to the crystal structure of GaN. For the samples implanted by 1014 cm-2 dose, the 2. 2eV PL structure almost eliminates in the as-implanted samples but may recover under a certain circumstance after annealing in N2 atmosphere. Compared to rapid thermal annealing (RTA) (1 000℃ , 10-20s. ), normally annealing (850℃, 20mm) appears to be advantage in recovering the 2. 2eV emission peak with the integral light intensity three times than RTA samples. Similar results are also obtained from the samples implanted with 1015 cm2 dose. 2. 2eV yellow luminescence (YL) is from the defects such as Ga vacancy (VGa), or VGa- H2, or VGa-ON complex, with the energy level(s) located at about 1.1eV above the valence band. Therefore, YL may not only be from the transitions between the conduction band and the defect levels, but also from the transitions between shallow donors and the defect levels, such as nitride-site oxygen with the activation energy about 10 meV below the conduction band. The I-V measurement shows that the implanted area became a high resistance film with the line resistivity as high as 1012 Ω· cm-1 which indicates some Al+ implantation-induced deep electron traps. The conductive electron could be seized by such traps, which led to the luminescence emission disappeared. However, some such defects can be annealed under a certain heat treatment process, therefore the 2. 2eV emission peak can be partly recovered.
出处 《液晶与显示》 CAS CSCD 2002年第2期84-91,共8页 Chinese Journal of Liquid Crystals and Displays
基金 中国博士后基金会暨王宽诚基金会资助项目 (1999No.5 2000No.17) 安徽省自然科学基金资助项目(0046506
关键词 Al离子注入 GAN 发光特性 退火 铝离子注入 氮化镓 电子陷阱 GaN luminescence properties annealing effects aluminum-implantation
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参考文献19

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