摘要
采用Ｂｏｄｎｅｒ－Ｐａｒｔｏｍ粘塑性本构理论研究了Ｓｎ－Ｐｂ共晶合金的本构方程。在应变速率１０－５—１０－２Ｓ－１、温度为－５５—１２５℃的外部变量范围内进行了单轴拉伸和稳态蠕变数值模拟，结果与实验吻合良好。同时讨论了该本构方程用于ＳＭＴ焊点热循环寿命预测的实际意义。
odnerPartom viscoplastic constitutive theory was used to study the constitutive equations of Sn60Pb40 eutectic solder alloy. The deformation phenomena associated with the solders montonic and steadystate creep response were accurately predicted for 10-5S-1≤ε≤10-2S-1 and -55℃≤T≤125℃. The realistic meaning of using this constitutive equations for life predicting of SMT solder joint under thermomechanical cycle conditions is also discussed.
出处
《应用力学学报》
CAS
CSCD
北大核心
1998年第2期87-90,共4页
Chinese Journal of Applied Mechanics
关键词
本构方程
粘塑性
数值模拟
钎料
锡-铅共晶合金
constitutive equation, viscoplastic, Sn60Pb40 eutectic solder alloy, mathematical simulation.
