摘要
本文采用扫描电镜、能谱分析、金相切片等手段,对电路板上含银电子元器件进行失效分析,研究了片状电阻、轻触开关、继电器、TOP-LED等含银电子元器件的失效机理。结果表明,大气环境中的硫、整机原材料和生产辅料中的硫都可能导致电子元器件产生硫化腐蚀或电化学迁移,从而引起接触不良、开路、发黑、绝缘电阻下降等故障。并针对电路板的结构设计、生产工艺、材料选型等方面提出了改进和预防措施。
Based on the failure analysis of the circuit board containing silver electronic components, and by means of scanning electron microscope, energy spectrum analysis, metallographic sectioning, then the failure mechanism of the silver-bearing electron components, such as chip resistor, touch switch, electric relay and TOP-LED, etc. is researched. The result shows that the sulphur in atmospheric environment, materials in the machine, and production process can lead to the sulfide corrosion and electrochemical migration of electronic components. Thus it will result in the faults such as poor contact, open circuit, black coating, and insulation resistance, etc. finally, combined with the structure design, production process and materials selection, etc., the improvement and prevention measures are put forward.
出处
《日用电器》
2014年第5期43-46,共4页
ELECTRICAL APPLIANCES
关键词
电路板
硫化
电化学迁移
失效
PCBA （ printed circuit board assenbly）
sulfuration
electrochemical migration
failure
