摘要
报道了国际上关于硅基光子集成的最新研究进展和本课题组在该领域的研究成果,包括对一些光收发模块、III-V族/硅基激光器等集成器件的结构改进和工艺的探索,展示了兼容互补金属氧化物半导体工艺的硅基光子集成在信息技术领域中的巨大前景.可以预见,硅基光子集成已成为硅光子学的主要研究内容,硅光子学及硅基光子集成的发展目标是趋向更高速率、更低功耗及更大集成密度.
The research progress of the silicon-based photonic integration in the world and the results of our group in recent years are reported in this paper, including exploration of design and improvement on process of the optical transceiver modules, Ⅲ-Ⅴ/silicon lasers and other integrated photonics. The silicon photonics is predicted to have a great prospect in many fields due to its good compatibility with complementary metal oxide semiconductor technology. It is concluded that the trend of photonic integration on silicon substrate is toward high data rate, low power consumption and large integration density, and the silicon based photonic integration will become a main research subject of silicon photonics in the future.
出处
《物理学报》
SCIE
EI
CAS
CSCD
北大核心
2014年第10期1-8,共8页
Acta Physica Sinica
基金
国家重点基础研究发展计划(批准号:2011CB301701)
国家高技术研究发展计划(批准号:2012AA012202)
国家自然科学基金(批准号:61275065)资助的课题~~
关键词
硅光子学
光子集成
光子集成回路
光电子集成
silicon photonics
integrated photonics
photonic integrated circuits
optoelectronic integration
作者简介
E-mail：yudeyu@semi．ac．cn
